MediaTek Dimensity 1000+ | HiSilicon Kirin 970 | |
CPU comparisonMediaTek Dimensity 1000+ or HiSilicon Kirin 970 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 1000+ has 8 cores with 8 threads and clocks with a maximum frequency of 2.60 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 1000+ was released in Q2/2020. The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017. |
||
Mediatek Dimensity (36) | Family | HiSilicon Kirin (29) |
MediaTek Dimensity 1000 (4) | CPU group | HiSilicon Kirin 970 (1) |
1 | Generation | 6 |
Cortex-A77 / Cortex-A55 | Architecture | Cortex-A73 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe MediaTek Dimensity 1000+ is a 8 core processor with a clock frequency of 2.60 GHz. The HiSilicon Kirin 970 has 8 CPU cores with a clock frequency of 2.40 GHz. |
||
MediaTek Dimensity 1000+ | Characteristic | HiSilicon Kirin 970 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.60 GHz 4x Cortex-A77 |
A-Core | 2.40 GHz 4x Cortex-A73 |
2.00 GHz 4x Cortex-A55 |
B-Core | 1.84 GHz 4x Cortex-A53 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
||
MediaTek Dimensity 1000+ | Characteristic | HiSilicon Kirin 970 |
Mediatek APU 3.0 | AI hardware | -- |
-- | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
||
ARM Mali-G77 MP9 | GPU | ARM Mali-G72 MP12 |
0.85 GHz | GPU frequency | 0.75 GHz |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | Bifrost 2 |
7 nm | Technology | 16 nm |
1 | Max. displays | 1 |
9 | Compute units | 12 |
144 | Shader | 192 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 2 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
ARM Mali-G77 MP9 | GPU | ARM Mali-G72 MP12 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 1000+ supports a maximum of 16 GB of memory in 4 memory channels. The HiSilicon Kirin 970 can connect up to 8 GB of memory in 4 memory channels. |
||
MediaTek Dimensity 1000+ | Characteristic | HiSilicon Kirin 970 |
LPDDR4X-1866 | Memory | LPDDR4X-2133 |
16 GB | Max. Memory | 8 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
29.8 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The MediaTek Dimensity 1000+ has a TDP of --, that of the HiSilicon Kirin 970 is 9 W. |
||
MediaTek Dimensity 1000+ | Characteristic | HiSilicon Kirin 970 |
-- | TDP (PL1 / PBP) | 9 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 1000+ has a 0.00 MB cache, while the HiSilicon Kirin 970 cache has a total of 2.00 MB. |
||
MediaTek Dimensity 1000+ | Characteristic | HiSilicon Kirin 970 |
7 nm | Technology | 10 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2020 | Release date | Q3/2017 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000+
ARM Mali-G77 MP9 @ 0.85 GHz |
|||
HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000+
8C 8T @ 2.60 GHz |
|||
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Devices using this processor |
|
MediaTek Dimensity 1000+ | HiSilicon Kirin 970 |
Unknown | Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4 |