Intel Xeon D-2775TE | Qualcomm Snapdragon 870 | |
CPU comparisonIntel Xeon D-2775TE or Qualcomm Snapdragon 870 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Intel Xeon D-2775TE has 16 cores with 32 threads and clocks with a maximum frequency of 3.10 GHz. Up to 1024 GB of memory is supported in 4 memory channels. The Intel Xeon D-2775TE was released in Q1/2022. The Qualcomm Snapdragon 870 has 8 cores with 8 threads and clocks with a maximum frequency of 3.20 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 870 was released in Q2/2021. |
||
Intel Xeon D (79) | Family | Qualcomm Snapdragon (102) |
Intel Xeon D-2700 (16) | CPU group | Qualcomm Snapdragon 865/870 (3) |
4 | Generation | 7 |
Ice Lake | Architecture | Kryo 585 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe Intel Xeon D-2775TE is a 16 core processor with a clock frequency of 2.00 GHz (3.10 GHz). The Qualcomm Snapdragon 870 has 8 CPU cores with a clock frequency of 3.20 GHz. |
||
Intel Xeon D-2775TE | Characteristic | Qualcomm Snapdragon 870 |
16 | Cores | 8 |
32 | Threads | 8 |
normal | Core architecture | hybrid (Prime / big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz (3.10 GHz) 16x Sunny Cove |
A-Core | 3.20 GHz 1x Kryo 585 Prime |
-- | B-Core | 2.42 GHz 3x Kryo 585 Gold |
-- | C-Core | 1.80 GHz 4x Kryo 585 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
||
Intel Xeon D-2775TE | Characteristic | Qualcomm Snapdragon 870 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 698 @ 15 TOPS |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
||
no iGPU | GPU | Qualcomm Adreno 650 |
GPU frequency | 0.25 GHz | |
-- | GPU (Turbo) | 0.67 GHz |
-- | GPU Generation | 6 |
Technology | 7 nm | |
Max. displays | 1 | |
-- | Compute units | 2 |
-- | Shader | 512 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
-- | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
no iGPU | GPU | Qualcomm Adreno 650 |
No | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
No | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode / Encode |
No | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
No | Codec AVC | Decode |
No | Codec VC-1 | Decode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe Intel Xeon D-2775TE supports a maximum of 1024 GB of memory in 4 memory channels. The Qualcomm Snapdragon 870 can connect up to 16 GB of memory in 4 memory channels. |
||
Intel Xeon D-2775TE | Characteristic | Qualcomm Snapdragon 870 |
DDR4-2933 | Memory | LPDDR5-5500, LPDDR4X-4266 |
1024 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
93.8 GB/s | Max. Bandwidth | 44.0 GB/s |
Yes | ECC | No |
25.00 MB | L2 Cache | 2.00 MB |
-- | L3 Cache | 7.00 MB |
4.0 | PCIe version | -- |
32 | PCIe lanes | -- |
63.0 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The Intel Xeon D-2775TE has a TDP of 100 W, that of the Qualcomm Snapdragon 870 is 10 W. |
||
Intel Xeon D-2775TE | Characteristic | Qualcomm Snapdragon 870 |
100 W | TDP (PL1 / PBP) | 10 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Intel Xeon D-2775TE has a 25.00 MB cache, while the Qualcomm Snapdragon 870 cache has a total of 9.00 MB. |
||
Intel Xeon D-2775TE | Characteristic | Qualcomm Snapdragon 870 |
10 nm | Technology | 7 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4.1, SSE4.2, AVX2, AVX-512 | ISA extensions | -- |
BGA 2579 | Socket | -- |
VT-x, VT-x EPT, VT-d | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q1/2022 | Release date | Q2/2021 |
1784 $ | Release price | -- |
show more data | show more data | |
Intel Xeon D-2775TE
16C 32T @ 3.10 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
16C 32T @ 2.30 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
16C 32T @ 3.10 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
16C 32T @ 2.30 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
@ 0.00 GHz |
|||
Qualcomm Snapdragon 870
Qualcomm Adreno 650 @ 0.67 GHz |
Intel Xeon D-2775TE
16C 32T @ 2.00 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
16C 32T @ 2.00 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
16C 32T @ 2.30 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Intel Xeon D-2775TE
16C 32T @ 2.00 GHz |
|||
Qualcomm Snapdragon 870
8C 8T @ 3.20 GHz |
Devices using this processor |
|
Intel Xeon D-2775TE | Qualcomm Snapdragon 870 |
Unknown | Unknown |