HiSilicon Kirin 960S | Qualcomm Snapdragon 835 | |
CPU comparisonHiSilicon Kirin 960S or Qualcomm Snapdragon 835 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 960S has 8 cores with 8 threads and clocks with a maximum frequency of 2.11 GHz. Up to 6 GB of memory is supported in 2 memory channels. The HiSilicon Kirin 960S was released in Q4/2016. The Qualcomm Snapdragon 835 has 8 cores with 8 threads and clocks with a maximum frequency of 2.45 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 835 was released in Q2/2017. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 960 (2) | CPU group | Qualcomm Snapdragon 830 (1) |
5 | Generation | 4 |
Cortex-A73 / Cortex-A53 | Architecture | Kryo 280 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | Qualcomm Snapdragon 845 |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 960S has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 960S is 2.11 GHz while the Qualcomm Snapdragon 835 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 835 is at 2.45 GHz. |
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HiSilicon Kirin 960S | Characteristic | Qualcomm Snapdragon 835 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.11 GHz 4x Cortex-A73 |
A-Core | 2.45 GHz 4x Kryo 280 Gold |
1.84 GHz 4x Cortex-A53 |
B-Core | 1.90 GHz 4x Kryo 280 Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 960S | Characteristic | Qualcomm Snapdragon 835 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 682 |
Internal GraphicsThe HiSilicon Kirin 960S or Qualcomm Snapdragon 835 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G71 MP8 | GPU | Qualcomm Adreno 540 |
0.90 GHz | GPU frequency | 0.71 GHz |
-- | GPU (Turbo) | 0.71 GHz |
Bifrost 1 | GPU Generation | 5 |
16 nm | Technology | 10 nm |
2 | Max. displays | 0 |
8 | Compute units | -- |
256 | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
2 GB | Max. GPU Memory | -- |
11 | DirectX Version | 11.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G71 MP8 | GPU | Qualcomm Adreno 540 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode |
No | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
No | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode |
Memory & PCIeThe HiSilicon Kirin 960S can use up to 6 GB of memory in 2 memory channels. The maximum memory bandwidth is 12.8 GB/s. The Qualcomm Snapdragon 835 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 14.9 GB/s. |
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HiSilicon Kirin 960S | Characteristic | Qualcomm Snapdragon 835 |
LPDDR4-1600 | Memory | LPDDR4X-3733 |
6 GB | Max. Memory | 8 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
12.8 GB/s | Max. Bandwidth | 14.9 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
4.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 960S is 5 W, while the Qualcomm Snapdragon 835 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 960S | Characteristic | Qualcomm Snapdragon 835 |
5 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 960S is manufactured in 16 nm and has 4.00 MB cache. The Qualcomm Snapdragon 835 is manufactured in 10 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 960S | Characteristic | Qualcomm Snapdragon 835 |
16 nm | Technology | 10 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2016 | Release date | Q2/2017 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 960S
ARM Mali-G71 MP8 @ 0.90 GHz |
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Qualcomm Snapdragon 835
Qualcomm Adreno 540 @ 0.71 GHz |
HiSilicon Kirin 960S
8C 8T @ 2.11 GHz |
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Qualcomm Snapdragon 835
8C 8T @ 2.45 GHz |
HiSilicon Kirin 960S
8C 8T @ 2.11 GHz |
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Qualcomm Snapdragon 835
8C 8T @ 2.45 GHz |
HiSilicon Kirin 960S
8C 8T @ 2.11 GHz |
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Qualcomm Snapdragon 835
8C 8T @ 2.45 GHz |
HiSilicon Kirin 960S
8C 8T @ 2.11 GHz |
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Qualcomm Snapdragon 835
8C 8T @ 2.45 GHz |
HiSilicon Kirin 960S
8C 8T @ 2.11 GHz |
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Qualcomm Snapdragon 835
8C 8T @ 2.45 GHz |
HiSilicon Kirin 960S
8C 8T @ 2.11 GHz |
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Qualcomm Snapdragon 835
8C 8T @ 2.45 GHz |
Devices using this processor |
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HiSilicon Kirin 960S | Qualcomm Snapdragon 835 |
Unknown | Unknown |