HiSilicon Kirin 930 vs HiSilicon Kirin 970

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CPU comparison with benchmarks


HiSilicon Kirin 930 CPU1 vs CPU2 HiSilicon Kirin 970
HiSilicon Kirin 930 HiSilicon Kirin 970

CPU comparison

HiSilicon Kirin 930 or HiSilicon Kirin 970 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The HiSilicon Kirin 930 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 2 memory channels. The HiSilicon Kirin 930 was released in Q1/2015.

The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017.
HiSilicon Kirin (29) Family HiSilicon Kirin (29)
HiSilicon Kirin 930 (2) CPU group HiSilicon Kirin 970 (1)
3 Generation 6
Cortex-A53 / Cortex-A53 Architecture Cortex-A73 / Cortex-A53
Mobile Segment Mobile
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The HiSilicon Kirin 930 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 930 is 2.00 GHz while the HiSilicon Kirin 970 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 970 is at 2.40 GHz.

HiSilicon Kirin 930 Characteristic HiSilicon Kirin 970
8 Cores 8
8 Threads 8
hybrid (big.LITTLE) Core architecture hybrid (big.LITTLE)
No Hyperthreading No
No Overclocking ? No
2.00 GHz
4x Cortex-A53
A-Core 2.40 GHz
4x Cortex-A73
1.50 GHz
4x Cortex-A53
B-Core 1.84 GHz
4x Cortex-A53

Artificial Intelligence and Machine Learning

Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.

HiSilicon Kirin 930 Characteristic HiSilicon Kirin 970
-- AI hardware --
-- AI specifications --

Internal Graphics

The HiSilicon Kirin 930 or HiSilicon Kirin 970 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

ARM Mali-T628 MP4 GPU ARM Mali-G72 MP12
0.60 GHz GPU frequency 0.75 GHz
0.60 GHz GPU (Turbo) --
Midgard 2 GPU Generation Bifrost 2
32nm Technology 16 nm
1 Max. displays 1
4 Compute units 12
64 Shader 192
No Hardware Raytracing No
No Frame Generation No
-- Max. GPU Memory 2 GB
11 DirectX Version 12

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

ARM Mali-T628 MP4 GPU ARM Mali-G72 MP12
No Codec h265 / HEVC (8 bit) Decode / Encode
No Codec h265 / HEVC (10 bit) Decode / Encode
Decode / Encode Codec h264 Decode / Encode
No Codec VP9 Decode / Encode
Decode / Encode Codec VP8 Decode / Encode
No Codec AV1 No
No Codec AVC Decode / Encode
No Codec VC-1 Decode / Encode
No Codec JPEG Decode / Encode

Memory & PCIe

The HiSilicon Kirin 930 can use up to GB of memory in 2 memory channels. The maximum memory bandwidth is --. The HiSilicon Kirin 970 supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --.

HiSilicon Kirin 930 Characteristic HiSilicon Kirin 970
LPDDR3-1600 Memory LPDDR4X-2133
Max. Memory 8 GB
2 (Dual Channel) Memory channels 4 (Quad Channel)
-- Max. Bandwidth --
No ECC No
-- L2 Cache --
-- L3 Cache 2.00 MB
-- PCIe version --
-- PCIe lanes --
-- PCIe Bandwidth --

Thermal Management

The thermal design power (TDP for short) of the HiSilicon Kirin 930 is --, while the HiSilicon Kirin 970 has a TDP of 9 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

HiSilicon Kirin 930 Characteristic HiSilicon Kirin 970
-- TDP (PL1 / PBP) 9 W
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. --

Technical details

The HiSilicon Kirin 930 is manufactured in 28 nm and has 0.00 MB cache. The HiSilicon Kirin 970 is manufactured in 10 nm and has a 2.00 MB cache.

HiSilicon Kirin 930 Characteristic HiSilicon Kirin 970
28 nm Technology 10 nm
Chiplet Chip design Chiplet
Armv8-A (64 bit) Instruction set (ISA) Armv8-A (64 bit)
-- ISA extensions --
-- Socket --
None Virtualization None
No AES-NI No
Android Operating systems Android
Q1/2015 Release date Q3/2017
-- Release price --
show more data show more data


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iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
HiSilicon Kirin 930 HiSilicon Kirin 930
ARM Mali-T628 MP4 @ 0.60 GHz
77 (23%)
HiSilicon Kirin 970 HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz
330 (100%)

Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
HiSilicon Kirin 930 HiSilicon Kirin 930
8C 8T @ 2.00 GHz
0 (0%)
HiSilicon Kirin 970 HiSilicon Kirin 970
8C 8T @ 2.40 GHz
349 (100%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
HiSilicon Kirin 930 HiSilicon Kirin 930
8C 8T @ 2.00 GHz
0 (0%)
HiSilicon Kirin 970 HiSilicon Kirin 970
8C 8T @ 2.40 GHz
1455 (100%)

Devices using this processor

HiSilicon Kirin 930 HiSilicon Kirin 970
Unknown Huawei Honor 10
Huawei Note 10
Huawei Play
Huawei Honor View 10
Huawei Mate 10 Pro
Huawei P20
Huawei Nova 3
Huawei Nova 4

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