HiSilicon Kirin 810 | Intel Xeon Gold 5318H | |
CPU comparisonHiSilicon Kirin 810 or Intel Xeon Gold 5318H - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. The Intel Xeon Gold 5318H has 18 cores with 36 threads and clocks with a maximum frequency of 3.80 GHz. The CPU supports up to 1146 GB of memory in 6 memory channels. The Intel Xeon Gold 5318H was released in Q2/2020. |
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HiSilicon Kirin (29) | Family | Intel Xeon Gold (163) |
HiSilicon Kirin 810/820 (3) | CPU group | Intel Xeon Gold 5300/6300 (6) |
6 | Generation | 3 |
Cortex-A76 / Cortex-A55 | Architecture | Cooper Lake |
Mobile | Segment | Desktop / Server |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 810 is 2.20 GHz while the Intel Xeon Gold 5318H has 18 CPU cores and 36 threads can calculate simultaneously. The clock frequency of the Intel Xeon Gold 5318H is at 2.50 GHz (3.80 GHz). |
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HiSilicon Kirin 810 | Characteristic | Intel Xeon Gold 5318H |
8 | Cores | 18 |
8 | Threads | 36 |
hybrid (big.LITTLE) | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | No |
2.20 GHz 2x Cortex-A76 |
A-Core | 2.50 GHz (3.80 GHz) |
1.90 GHz 6x Cortex-A55 |
B-Core | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 810 or Intel Xeon Gold 5318H has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G52 MP6 | GPU | no iGPU |
0.85 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Bifrost 2 | GPU Generation | -- |
12 nm | Technology | |
2 | Max. displays | |
16 | Compute units | -- |
288 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G52 MP6 | GPU | no iGPU |
Decode / Encode | Codec h265 / HEVC (8 bit) | No |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | No |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe HiSilicon Kirin 810 can use up to 6 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Intel Xeon Gold 5318H supports up to 1146 GB of memory in 6 memory channels and achieves a memory bandwidth of up to 128.1 GB/s. |
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HiSilicon Kirin 810 | Characteristic | Intel Xeon Gold 5318H |
LPDDR4X-2133 | Memory | DDR4-2666 |
6 GB | Max. Memory | 1146 GB |
4 (Quad Channel) | Memory channels | 6 (Hexa Channel) |
-- | Max. Bandwidth | 128.1 GB/s |
No | ECC | Yes |
-- | L2 Cache | -- |
1.00 MB | L3 Cache | 24.75 MB |
-- | PCIe version | 3.0 |
-- | PCIe lanes | 48 |
-- | PCIe Bandwidth | 47.3 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 810 is 5 W, while the Intel Xeon Gold 5318H has a TDP of 150 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 810 | Characteristic | Intel Xeon Gold 5318H |
5 W | TDP (PL1 / PBP) | 150 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 810 is manufactured in 7 nm and has 1.00 MB cache. The Intel Xeon Gold 5318H is manufactured in 14 nm and has a 24.75 MB cache. |
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HiSilicon Kirin 810 | Characteristic | Intel Xeon Gold 5318H |
7 nm | Technology | 14 nm |
Chiplet | Chip design | Monolithic |
Armv8-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4.1, SSE4.2, AVX2, AVX-512 |
-- | Socket | P+ |
None | Virtualization | VT-x, VT-x EPT, VT-d |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Linux |
Q2/2019 | Release date | Q2/2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Intel Xeon Gold 5318H
18C 36T @ 3.80 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Intel Xeon Gold 5318H
18C 36T @ 2.50 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Intel Xeon Gold 5318H
18C 36T @ 3.80 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Intel Xeon Gold 5318H
18C 36T @ 2.50 GHz |
HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
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Intel Xeon Gold 5318H
@ 0.00 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Intel Xeon Gold 5318H
18C 36T @ 2.50 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Intel Xeon Gold 5318H
18C 36T @ 2.50 GHz |
Devices using this processor |
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HiSilicon Kirin 810 | Intel Xeon Gold 5318H |
Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |
Unknown |