Samsung S5L8900

Samsung S5L8900
Benchmarks & Specs

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The Samsung S5L8900 was an important mobile processor in its time. It was based on the ARM 1176 architecture, which enabled solid performance for mobile devices of that era. It was manufactured using a 90-nanometer process. This was an advanced step and significantly contributed to energy efficiency.

We know that this architecture drove the development of compact solutions. A particularly notable feature was the integrated PowerVR MBX Lite graphics unit. It was essential for rendering graphical content on devices. Thanks to it, users could experience multimedia applications. The Samsung S5L8900 often formed the core of many popular mobile phones at the time.

Its balanced design provided a reliable basis for a wide variety of applications. It demonstrated what technical performance was achievable in this device class. The implementation at the time was a significant step forward for us. This chip paved the way for future, even more powerful generations.
  • ARM 1176 Architecture
  • Efficient 90-nanometer manufacturing
  • Integrated PowerVR MBX Lite graphics
  • Basis for mobile innovations

Performance Overview
Average performance across multiple benchmarks

Single-core performance
Rank ? / ?
In segment Smartphone / Tablet
Multi-core performance
Rank ? / ?
In segment Smartphone / Tablet

More benchmarks

At a glance

PropertyValue
FamilySamsung S5L (3)
CPU groupSamsung S5L8900 (1)
ArchitectureARM 1176
Technology90 nm
SegmentSmartphone / Tablet
Socket
Generation1
Predecessor
Successor

CPU Cores and Base Frequency

PropertyValue
CPU Cores / Threads1 / 1
Hyperthreading / SMT
Core architecturenormal
Cores: 1x
Frequency: 0.40 GHz
Turbo Frequency (1 Core):
Turbo Frequency (1 Cores):
L2-Cache
L3-Cache
OverclockingNo

Integrated graphics (iGPU)

PropertyValue
GPU namePowerVR MBX Lite
GPU frequency
CUs / Shader1 / 1
Raytracing
Max. displays1
Max. GPU Memory
Technology130nm
Release dateQ1/2001

Memory & PCIe

Memory typeMemory bandwidth
PropertyValue
Max. Memory
Memory channels0
ECC
PCIe
PCIe Bandwidth

Thermal Management

PropertyValue
TDP
TDP (PL2)
TDP up
TDP down
T. junction max.

Technical details

PropertyValue
Chip design
AES-NI
Operating systemsAndroid
Instruction setArmv7-A (32 bit)
ISA extensions
Release dateQ1/2007
Release price
Documents
Samsung S5L8900
Samsung S5L8900
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