Samsung Exynos 850 | HiSilicon Kirin 710A | |
CPU comparisonSamsung Exynos 850 or HiSilicon Kirin 710A - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Samsung Exynos 850 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to GB of memory is supported in 0 memory channels. The Samsung Exynos 850 was released in Q2/2020. The HiSilicon Kirin 710A has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. The CPU supports up to 6 GB of memory in 2 memory channels. The HiSilicon Kirin 710A was released in Q2/2020. |
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Samsung Exynos (47) | Family | HiSilicon Kirin (29) |
Samsung Exynos 800 (2) | CPU group | HiSilicon Kirin 710A (1) |
4 | Generation | 5 |
Cortex-A77 / Cortex-A55 | Architecture | Cortex-A73 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Samsung Exynos 850 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Samsung Exynos 850 is 2.00 GHz while the HiSilicon Kirin 710A has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 710A is at 2.00 GHz. |
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Samsung Exynos 850 | Characteristic | HiSilicon Kirin 710A |
8 | Cores | 8 |
8 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 8x Cortex-A55 |
A-Core | 2.00 GHz 4x Cortex-A73 |
-- | B-Core | 1.60 GHz 4x Cortex-A53 |
Integrated graphics (iGPU)The Samsung Exynos 850 or HiSilicon Kirin 710A has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G52 MP1 | GPU | ARM Mali-G51 MP4 |
0.85 GHz | GPU frequency | 0.65 GHz |
-- | GPU (Turbo) | 1.00 GHz |
Bifrost 2 | GPU Generation | Bifrost 1 |
16 nm | Technology | 12 nm |
2 | Max. displays | 2 |
1 | Compute units | 8 |
16 | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G52 MP1 | GPU | ARM Mali-G51 MP4 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Samsung Exynos 850 can use up to GB of memory in 0 memory channels. The maximum memory bandwidth is --. The HiSilicon Kirin 710A supports up to 6 GB of memory in 2 memory channels and achieves a memory bandwidth of up to --. |
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Samsung Exynos 850 | Characteristic | HiSilicon Kirin 710A |
LPDDR4X | Memory | LPDDR4, LPDDR3 |
Max. Memory | 6 GB | |
0 | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 1.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Samsung Exynos 850 is --, while the HiSilicon Kirin 710A has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Samsung Exynos 850 | Characteristic | HiSilicon Kirin 710A |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Samsung Exynos 850 is manufactured in 8 nm and has 0.00 MB cache. The HiSilicon Kirin 710A is manufactured in 14 nm and has a 1.00 MB cache. |
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Samsung Exynos 850 | Characteristic | HiSilicon Kirin 710A |
8 nm | Technology | 14 nm |
Unknown | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2020 | Release date | Q2/2020 |
-- | Release price | -- |
show more data | show more data | |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Samsung Exynos 850
ARM Mali-G52 MP1 @ 0.85 GHz |
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HiSilicon Kirin 710A
ARM Mali-G51 MP4 @ 1.00 GHz |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Samsung Exynos 850
8C 8T @ 2.00 GHz |
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HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
Devices using this processor |
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Samsung Exynos 850 | HiSilicon Kirin 710A |
Unknown | Honor 10X Lite |