Qualcomm Snapdragon 865+ | MediaTek Dimensity 6100+ | |
CPU comparisonIn this CPU comparison, we compare the Qualcomm Snapdragon 865+ and the MediaTek Dimensity 6100+ and use benchmarks to check which processor is faster.
We compare the Qualcomm Snapdragon 865+ 8 core processor released in Q3/2020 with the MediaTek Dimensity 6100+ which has 8 CPU cores and was introduced in Q3/2023. |
||
Qualcomm Snapdragon (102) | Family | Mediatek Dimensity (36) |
Qualcomm Snapdragon 865/870 (3) | CPU group | MediaTek Dimensity 6000 (3) |
7 | Generation | 0 |
Kryo 585 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe Qualcomm Snapdragon 865+ is a 8 core processor with a clock frequency of 3.10 GHz. The processor can compute 8 threads at the same time. The MediaTek Dimensity 6100+ clocks with 2.20 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
||
Qualcomm Snapdragon 865+ | Characteristic | MediaTek Dimensity 6100+ |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.10 GHz 1x Kryo 585 Prime |
A-Core | 2.20 GHz 2x Cortex-A76 |
2.42 GHz 3x Kryo 585 Gold |
B-Core | 2.00 GHz 6x Cortex-A55 |
1.80 GHz 4x Kryo 585 Silver |
C-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
||
Qualcomm Snapdragon 865+ | Characteristic | MediaTek Dimensity 6100+ |
Qualcomm AI engine | AI hardware | -- |
Hexagon 698 @ 15 TOPS | AI specifications | -- |
Internal GraphicsGraphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
||
Qualcomm Adreno 650 | GPU | ARM Mali-G57 MP2 |
0.25 GHz | GPU frequency | 1.10 GHz |
0.67 GHz | GPU (Turbo) | 1.10 GHz |
6 | GPU Generation | Vallhall 1 |
7 nm | Technology | 7 nm |
1 | Max. displays | 2 |
2 | Compute units | 2 |
512 | Shader | 32 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
Qualcomm Adreno 650 | GPU | ARM Mali-G57 MP2 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 16 GB of memory in a maximum of 4 memory channels is supported by the Qualcomm Snapdragon 865+, while the MediaTek Dimensity 6100+ supports a maximum of 12 GB of memory with a maximum memory bandwidth of 17.1 GB/s enabled. |
||
Qualcomm Snapdragon 865+ | Characteristic | MediaTek Dimensity 6100+ |
LPDDR5-5500, LPDDR4X-4266 | Memory | LPDDR4X-4266 |
16 GB | Max. Memory | 12 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
44.0 GB/s | Max. Bandwidth | 17.1 GB/s |
No | ECC | No |
2.00 MB | L2 Cache | -- |
3.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe Qualcomm Snapdragon 865+ has a TDP of 10 W. The TDP of the MediaTek Dimensity 6100+ is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
||
Qualcomm Snapdragon 865+ | Characteristic | MediaTek Dimensity 6100+ |
10 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 865+ has 5.00 MB cache and is manufactured in 7 nm. The cache of MediaTek Dimensity 6100+ is at 0.00 MB. The processor is manufactured in 7 nm. |
||
Qualcomm Snapdragon 865+ | Characteristic | MediaTek Dimensity 6100+ |
7 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2020 | Release date | Q3/2023 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 865+
Qualcomm Adreno 650 @ 0.67 GHz |
|||
MediaTek Dimensity 6100+
ARM Mali-G57 MP2 @ 1.10 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 865+
8C 8T @ 3.10 GHz |
|||
MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
Devices using this processor |
|
Qualcomm Snapdragon 865+ | MediaTek Dimensity 6100+ |
Samsung Galaxy Tab S7 T870 Samsung Galaxy Tab S7 T875 ASUS ZenFone 7 Pro Samsung Galaxy Z Fold |
Unknown |