Qualcomm Snapdragon 808 | HiSilicon Kirin 810 | |
CPU comparisonQualcomm Snapdragon 808 or HiSilicon Kirin 810 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 808 has 6 cores with 6 threads and clocks with a maximum frequency of 1.82 GHz. Up to 8 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 808 was released in Q3/2014. The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 6 GB of memory in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. |
||
Qualcomm Snapdragon (104) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon 808/810 (3) | CPU group | HiSilicon Kirin 810/820 (3) |
2 | Generation | 6 |
Cortex-A57 / Cortex-A53 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe Qualcomm Snapdragon 808 has 6 CPU cores and can calculate 6 threads in parallel. The clock frequency of the Qualcomm Snapdragon 808 is 1.82 GHz while the HiSilicon Kirin 810 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 810 is at 2.20 GHz. |
||
Qualcomm Snapdragon 808 | Characteristic | HiSilicon Kirin 810 |
6 | Cores | 8 |
6 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
1.82 GHz 2x Cortex-A57 |
A-Core | 2.20 GHz 2x Cortex-A76 |
1.44 GHz 4x Cortex-A53 |
B-Core | 1.90 GHz 6x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
||
Qualcomm Snapdragon 808 | Characteristic | HiSilicon Kirin 810 |
Qualcomm AI engine | AI hardware | -- |
Hexagon QDSP V56 | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The Qualcomm Snapdragon 808 or HiSilicon Kirin 810 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
||
Qualcomm Adreno 418 | GPU | ARM Mali-G52 MP6 |
0.60 GHz | GPU frequency | 0.85 GHz |
0.60 GHz | GPU (Turbo) | -- |
4 | GPU Generation | Bifrost 2 |
20 nm | Technology | 12 nm |
0 | Max. displays | 2 |
-- | Compute units | 16 |
128 | Shader | 288 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
11 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
Qualcomm Adreno 418 | GPU | ARM Mali-G52 MP6 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode / Encode |
No | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
No | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 808 can use up to 8 GB of memory in 2 memory channels. The maximum memory bandwidth is 14.9 GB/s. The HiSilicon Kirin 810 supports up to 6 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
||
Qualcomm Snapdragon 808 | Characteristic | HiSilicon Kirin 810 |
LPDDR3-1866 | Memory | LPDDR4X-2133 |
8 GB | Max. Memory | 6 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
14.9 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 1.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 808 is --, while the HiSilicon Kirin 810 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
||
Qualcomm Snapdragon 808 | Characteristic | HiSilicon Kirin 810 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 808 is manufactured in 20 nm and has 0.00 MB cache. The HiSilicon Kirin 810 is manufactured in 7 nm and has a 1.00 MB cache. |
||
Qualcomm Snapdragon 808 | Characteristic | HiSilicon Kirin 810 |
20 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2014 | Release date | Q2/2019 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 808
Qualcomm Adreno 418 @ 0.60 GHz |
|||
HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Qualcomm Snapdragon 808
6C 6T @ 1.82 GHz |
|||
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
Devices using this processor |
|
Qualcomm Snapdragon 808 | HiSilicon Kirin 810 |
Unknown | Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |