Qualcomm Snapdragon 778G+ | MediaTek Dimensity 1050 | |
CPU comparisonQualcomm Snapdragon 778G+ or MediaTek Dimensity 1050 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 778G+ has 8 cores with 8 threads and clocks with a maximum frequency of 2.50 GHz. Up to 16 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 778G+ was released in Q4/2021. The MediaTek Dimensity 1050 has 8 cores with 8 threads and clocks with a maximum frequency of 2.50 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The MediaTek Dimensity 1050 was released in Q3/2022. |
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Qualcomm Snapdragon (102) | Family | Mediatek Dimensity (36) |
Qualcomm Snapdragon 778 (2) | CPU group | MediaTek Dimensity 10xx (2) |
4 | Generation | 2 |
Kryo 670 | Architecture | Cortex-A78 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 778G+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 778G+ is 2.50 GHz while the MediaTek Dimensity 1050 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the MediaTek Dimensity 1050 is at 2.50 GHz. |
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Qualcomm Snapdragon 778G+ | Characteristic | MediaTek Dimensity 1050 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.50 GHz 1x Kryo 670 Prime |
A-Core | 2.50 GHz 2x Cortex-A78 |
2.20 GHz 3x Kryo 670 Gold |
B-Core | 2.00 GHz 6x Cortex-A55 |
1.90 GHz 4x Kryo 670 Silver |
C-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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Qualcomm Snapdragon 778G+ | Characteristic | MediaTek Dimensity 1050 |
Qualcomm AI engine | AI hardware | -- |
Hexagon 770 @ 12 TOPS | AI specifications | -- |
Internal GraphicsThe Qualcomm Snapdragon 778G+ or MediaTek Dimensity 1050 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 642L | GPU | ARM Mali-G610 MP3 |
GPU frequency | 0.85 GHz | |
-- | GPU (Turbo) | -- |
5 | GPU Generation | Vallhall 3 |
6 nm | Technology | 4 nm |
1 | Max. displays | 1 |
4 | Compute units | 3 |
384 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 642L | GPU | ARM Mali-G610 MP3 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode | Codec VP9 | Decode / Encode |
Decode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 778G+ can use up to 16 GB of memory in 2 memory channels. The maximum memory bandwidth is 25.6 GB/s. The MediaTek Dimensity 1050 supports up to 16 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 44.0 GB/s. |
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Qualcomm Snapdragon 778G+ | Characteristic | MediaTek Dimensity 1050 |
LPDDR5-6400 | Memory | LPDDR5-5500, LPDDR4X-4266 |
16 GB | Max. Memory | 16 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
25.6 GB/s | Max. Bandwidth | 44.0 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 778G+ is --, while the MediaTek Dimensity 1050 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon 778G+ | Characteristic | MediaTek Dimensity 1050 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 778G+ is manufactured in 6 nm and has 2.00 MB cache. The MediaTek Dimensity 1050 is manufactured in 6 nm and has a 0.00 MB cache. |
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Qualcomm Snapdragon 778G+ | Characteristic | MediaTek Dimensity 1050 |
6 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2021 | Release date | Q3/2022 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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MediaTek Dimensity 1050
8C 8T @ 2.50 GHz |
Devices using this processor |
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Qualcomm Snapdragon 778G+ | MediaTek Dimensity 1050 |
Unknown | Unknown |