Qualcomm Snapdragon 778G+ | HiSilicon Kirin 990 4G | |
CPU comparisonQualcomm Snapdragon 778G+ or HiSilicon Kirin 990 4G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 778G+ has 8 cores with 8 threads and clocks with a maximum frequency of 2.50 GHz. Up to 16 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 778G+ was released in Q4/2021. The HiSilicon Kirin 990 4G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 990 4G was released in Q3/2019. |
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Qualcomm Snapdragon (102) | Family | HiSilicon Kirin (29) |
Qualcomm Snapdragon 778 (2) | CPU group | HiSilicon Kirin 990 (3) |
4 | Generation | 8 |
Kryo 670 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 778G+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 778G+ is 2.50 GHz while the HiSilicon Kirin 990 4G has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 990 4G is at 2.86 GHz. |
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Qualcomm Snapdragon 778G+ | Characteristic | HiSilicon Kirin 990 4G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.50 GHz 1x Kryo 670 Prime |
A-Core | 2.86 GHz 2x Cortex-A76 |
2.20 GHz 3x Kryo 670 Gold |
B-Core | 2.09 GHz 2x Cortex-A76 |
1.90 GHz 4x Kryo 670 Silver |
C-Core | 1.86 GHz 4x Cortex-A55 |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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Qualcomm Snapdragon 778G+ | Characteristic | HiSilicon Kirin 990 4G |
Qualcomm AI engine | AI hardware | HUAWEI HiAI 2.0 |
Hexagon 770 @ 12 TOPS | AI specifications | Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny |
Internal GraphicsThe Qualcomm Snapdragon 778G+ or HiSilicon Kirin 990 4G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 642L | GPU | ARM Mali-G76 MP16 |
GPU frequency | 0.60 GHz | |
-- | GPU (Turbo) | -- |
5 | GPU Generation | Bifrost 3 |
6 nm | Technology | 7 nm |
1 | Max. displays | 2 |
4 | Compute units | 16 |
384 | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12.0 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 642L | GPU | ARM Mali-G76 MP16 |
Decode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode | Codec VP9 | Decode / Encode |
Decode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode | Codec AVC | Decode / Encode |
Decode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Qualcomm Snapdragon 778G+ can use up to 16 GB of memory in 2 memory channels. The maximum memory bandwidth is 25.6 GB/s. The HiSilicon Kirin 990 4G supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Qualcomm Snapdragon 778G+ | Characteristic | HiSilicon Kirin 990 4G |
LPDDR5-6400 | Memory | LPDDR4X-2133 |
16 GB | Max. Memory | 8 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
25.6 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 778G+ is --, while the HiSilicon Kirin 990 4G has a TDP of 6 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon 778G+ | Characteristic | HiSilicon Kirin 990 4G |
-- | TDP (PL1 / PBP) | 6 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 778G+ is manufactured in 6 nm and has 2.00 MB cache. The HiSilicon Kirin 990 4G is manufactured in 7 nm and has a 2.00 MB cache. |
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Qualcomm Snapdragon 778G+ | Characteristic | HiSilicon Kirin 990 4G |
6 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2021 | Release date | Q3/2019 |
-- | Release price | -- |
show more data | show more data | |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
Qualcomm Snapdragon 778G+
Qualcomm Adreno 642L @ 0.00 GHz |
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HiSilicon Kirin 990 4G
ARM Mali-G76 MP16 @ 0.60 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
Devices using this processor |
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Qualcomm Snapdragon 778G+ | HiSilicon Kirin 990 4G |
Unknown | Huawei Mate 30 Pro |