Qualcomm Snapdragon 615 | Intel Xeon Platinum 8170M | |
CPU comparisonQualcomm Snapdragon 615 or Intel Xeon Platinum 8170M - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 615 has 8 cores with 8 threads and clocks with a maximum frequency of 1.50 GHz. Up to 4 GB of memory is supported in 1 memory channels. The Qualcomm Snapdragon 615 was released in Q3/2014. The Intel Xeon Platinum 8170M has 26 cores with 52 threads and clocks with a maximum frequency of 3.70 GHz. The CPU supports up to 1536 GB of memory in 6 memory channels. The Intel Xeon Platinum 8170M was released in Q3/2017. |
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Qualcomm Snapdragon (104) | Family | Intel Xeon Platinum (89) |
Qualcomm Snapdragon 610 (4) | CPU group | Intel Xeon Platinum 8100 (16) |
2 | Generation | 1 |
Cortex-A53 | Architecture | Skylake |
Mobile | Segment | Desktop / Server |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 615 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 615 is 1.50 GHz while the Intel Xeon Platinum 8170M has 26 CPU cores and 52 threads can calculate simultaneously. The clock frequency of the Intel Xeon Platinum 8170M is at 2.10 GHz (3.70 GHz). |
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Qualcomm Snapdragon 615 | Characteristic | Intel Xeon Platinum 8170M |
8 | Cores | 26 |
8 | Threads | 52 |
hybrid (big.LITTLE) | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | No |
1.50 GHz 4x Cortex-A53 |
A-Core | 2.10 GHz (3.70 GHz) |
1.00 GHz 4x Cortex-A53 |
B-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Qualcomm Snapdragon 615 | Characteristic | Intel Xeon Platinum 8170M |
Qualcomm AI engine | AI hardware | -- |
Hexagon | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The Qualcomm Snapdragon 615 or Intel Xeon Platinum 8170M has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 405 | GPU | no iGPU |
0.55 GHz | GPU frequency | -- |
0.55 GHz | GPU (Turbo) | -- |
4 | GPU Generation | -- |
28 nm | Technology | |
0 | Max. displays | |
-- | Compute units | -- |
48 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
11 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 405 | GPU | no iGPU |
Decode | Codec h265 / HEVC (8 bit) | No |
No | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | No |
No | Codec VP9 | No |
No | Codec VP8 | No |
No | Codec AV1 | No |
No | Codec AVC | No |
Decode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe Qualcomm Snapdragon 615 can use up to 4 GB of memory in 1 memory channels. The maximum memory bandwidth is 6.4 GB/s. The Intel Xeon Platinum 8170M supports up to 1536 GB of memory in 6 memory channels and achieves a memory bandwidth of up to 128.1 GB/s. |
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Qualcomm Snapdragon 615 | Characteristic | Intel Xeon Platinum 8170M |
LPDDR3-1600 | Memory | DDR4-2666 |
4 GB | Max. Memory | 1536 GB |
1 (Single Channel) | Memory channels | 6 (Hexa Channel) |
6.4 GB/s | Max. Bandwidth | 128.1 GB/s |
No | ECC | Yes |
-- | L2 Cache | -- |
-- | L3 Cache | 36.00 MB |
-- | PCIe version | 3.0 |
-- | PCIe lanes | 48 |
-- | PCIe Bandwidth | 47.3 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 615 is --, while the Intel Xeon Platinum 8170M has a TDP of 165 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon 615 | Characteristic | Intel Xeon Platinum 8170M |
-- | TDP (PL1 / PBP) | 165 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 615 is manufactured in 28 nm and has 0.00 MB cache. The Intel Xeon Platinum 8170M is manufactured in 14 nm and has a 36.00 MB cache. |
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Qualcomm Snapdragon 615 | Characteristic | Intel Xeon Platinum 8170M |
28 nm | Technology | 14 nm |
Chiplet | Chip design | Monolithic |
Armv8-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4.1, SSE4.2, AVX2, AVX-512 |
-- | Socket | LGA 3647 |
None | Virtualization | VT-x, VT-x EPT, VT-d |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Linux |
Q3/2014 | Release date | Q3/2017 |
-- | Release price | 10400 $ |
show more data | show more data | |
Qualcomm Snapdragon 615
8C 8T @ 1.50 GHz |
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Intel Xeon Platinum 8170M
26C 52T @ 3.70 GHz |
Qualcomm Snapdragon 615
8C 8T @ 1.50 GHz |
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Intel Xeon Platinum 8170M
26C 52T @ 2.50 GHz |
Qualcomm Snapdragon 615
Qualcomm Adreno 405 @ 0.55 GHz |
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Intel Xeon Platinum 8170M
@ 0.00 GHz |
Qualcomm Snapdragon 615
8C 8T @ 1.50 GHz |
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Intel Xeon Platinum 8170M
26C 52T @ 3.70 GHz |
Qualcomm Snapdragon 615
8C 8T @ 1.50 GHz |
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Intel Xeon Platinum 8170M
26C 52T @ 2.50 GHz |
Devices using this processor |
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Qualcomm Snapdragon 615 | Intel Xeon Platinum 8170M |
Unknown | Unknown |