MediaTek Helio G88 | HiSilicon Kirin 960 | |
CPU comparisonMediaTek Helio G88 or HiSilicon Kirin 960 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Helio G88 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to 8 GB of memory is supported in 2 memory channels. The MediaTek Helio G88 was released in Q2/2020. The HiSilicon Kirin 960 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 6 GB of memory in 2 memory channels. The HiSilicon Kirin 960 was released in Q4/2016. |
||
Mediatek Helio (37) | Family | HiSilicon Kirin (29) |
MediaTek Helio G70/G80 (4) | CPU group | HiSilicon Kirin 960 (2) |
1 | Generation | 5 |
Cortex-A75 / Cortex-A55 | Architecture | Cortex-A73 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe MediaTek Helio G88 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Helio G88 is 2.00 GHz while the HiSilicon Kirin 960 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 960 is at 2.40 GHz. |
||
MediaTek Helio G88 | Characteristic | HiSilicon Kirin 960 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 2x Cortex-A75 |
A-Core | 2.40 GHz 4x Cortex-A73 |
1.80 GHz 6x Cortex-A55 |
B-Core | 1.80 GHz 4x Cortex-A53 |
Internal GraphicsThe MediaTek Helio G88 or HiSilicon Kirin 960 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
||
ARM Mali-G52 MP2 | GPU | ARM Mali-G71 MP8 |
1.00 GHz | GPU frequency | 0.90 GHz |
-- | GPU (Turbo) | -- |
Bifrost 2 | GPU Generation | Bifrost 1 |
16 nm | Technology | 16 nm |
2 | Max. displays | 2 |
2 | Compute units | 8 |
32 | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 2 GB |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
ARM Mali-G52 MP2 | GPU | ARM Mali-G71 MP8 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Helio G88 can use up to 8 GB of memory in 2 memory channels. The maximum memory bandwidth is 14.4 GB/s. The HiSilicon Kirin 960 supports up to 6 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 12.8 GB/s. |
||
MediaTek Helio G88 | Characteristic | HiSilicon Kirin 960 |
Memory | LPDDR4-1600 | |
8 GB | Max. Memory | 6 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
14.4 GB/s | Max. Bandwidth | 12.8 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 4.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Helio G88 is --, while the HiSilicon Kirin 960 has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
||
MediaTek Helio G88 | Characteristic | HiSilicon Kirin 960 |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Helio G88 is manufactured in 12 nm and has 0.00 MB cache. The HiSilicon Kirin 960 is manufactured in 16 nm and has a 4.00 MB cache. |
||
MediaTek Helio G88 | Characteristic | HiSilicon Kirin 960 |
12 nm | Technology | 16 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2020 | Release date | Q4/2016 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Helio G88
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Helio G88
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Helio G88
ARM Mali-G52 MP2 @ 1.00 GHz |
|||
HiSilicon Kirin 960
ARM Mali-G71 MP8 @ 0.90 GHz |
MediaTek Helio G88
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Helio G88
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Helio G88
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
MediaTek Helio G88
8C 8T @ 2.00 GHz |
|||
HiSilicon Kirin 960
8C 8T @ 2.40 GHz |
Devices using this processor |
|
MediaTek Helio G88 | HiSilicon Kirin 960 |
Unknown | Huawei Honor 8 Pro Huawei Honor 9 Huawei Mate 9 Huawei Mate 9 Pro Huawei Mate 9 Porsche Huawei MediaPad M5 Huawei Nova 2s Huawei P10 |