MediaTek Dimensity 9200+ | Qualcomm Snapdragon 685 4G | |
CPU comparisonMediaTek Dimensity 9200+ or Qualcomm Snapdragon 685 4G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 9200+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.35 GHz. Up to GB of memory is supported in 4 memory channels. The MediaTek Dimensity 9200+ was released in Q2/2023. The Qualcomm Snapdragon 685 4G has 8 cores with 8 threads and clocks with a maximum frequency of 2.80 GHz. The CPU supports up to GB of memory in 2 memory channels. The Qualcomm Snapdragon 685 4G was released in Q1/2023. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (102) |
MediaTek Dimensity 9200 (2) | CPU group | Qualcomm Snapdragon 680 (2) |
4 | Generation | 6 |
Cortex-X3 / -A715 / -A510 | Architecture | Kryo 265 |
Mobile | Segment | Mobile |
MediaTek Dimensity 9000+ | Predecessor | Qualcomm Snapdragon 680 4G |
MediaTek Dimensity 9300 | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 9200+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 9200+ is 3.35 GHz while the Qualcomm Snapdragon 685 4G has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 685 4G is at 2.80 GHz. |
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MediaTek Dimensity 9200+ | Characteristic | Qualcomm Snapdragon 685 4G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.35 GHz 1x Cortex-X3 |
A-Core | 2.80 GHz 4x Kryo 265 Gold |
3.00 GHz 3x Cortex-A715 |
B-Core | 1.90 GHz 4x Kryo 265 Silver |
2.00 GHz 4x Cortex-A510 |
C-Core | -- |
Internal GraphicsThe MediaTek Dimensity 9200+ or Qualcomm Snapdragon 685 4G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Immortalis-G715 MP11 | GPU | Qualcomm Adreno 610 |
0.98 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Vallhall | GPU Generation | 6 |
4 nm | Technology | 11 nm |
0 | Max. displays | 0 |
11 | Compute units | -- |
-- | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Immortalis-G715 MP11 | GPU | Qualcomm Adreno 610 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 9200+ can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is 68.3 GB/s. The Qualcomm Snapdragon 685 4G supports up to GB of memory in 2 memory channels and achieves a memory bandwidth of up to 17.0 GB/s. |
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MediaTek Dimensity 9200+ | Characteristic | Qualcomm Snapdragon 685 4G |
LPDDR5X-8533 | Memory | LPDDR4X-2133 |
Max. Memory | ||
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
68.3 GB/s | Max. Bandwidth | 17.0 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 9200+ is --, while the Qualcomm Snapdragon 685 4G has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 9200+ | Characteristic | Qualcomm Snapdragon 685 4G |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 9200+ is manufactured in 4 nm and has 0.00 MB cache. The Qualcomm Snapdragon 685 4G is manufactured in 6 nm and has a 0.00 MB cache. |
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MediaTek Dimensity 9200+ | Characteristic | Qualcomm Snapdragon 685 4G |
4 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2023 | Release date | Q1/2023 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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Qualcomm Snapdragon 685 4G
8C 8T @ 2.80 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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Qualcomm Snapdragon 685 4G
8C 8T @ 2.80 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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Qualcomm Snapdragon 685 4G
8C 8T @ 2.80 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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Qualcomm Snapdragon 685 4G
8C 8T @ 2.80 GHz |
MediaTek Dimensity 9200+
ARM Immortalis-G715 MP11 @ 0.98 GHz |
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Qualcomm Snapdragon 685 4G
Qualcomm Adreno 610 @ 0.00 GHz |
MediaTek Dimensity 9200+
8C 8T @ 3.35 GHz |
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Qualcomm Snapdragon 685 4G
8C 8T @ 2.80 GHz |
Devices using this processor |
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MediaTek Dimensity 9200+ | Qualcomm Snapdragon 685 4G |
Unknown | Unknown |