MediaTek Dimensity 9000+ | Qualcomm Snapdragon 662 | |
CPU comparisonMediaTek Dimensity 9000+ or Qualcomm Snapdragon 662 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 9000+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.20 GHz. Up to GB of memory is supported in 4 memory channels. The MediaTek Dimensity 9000+ was released in Q3/2022. The Qualcomm Snapdragon 662 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 662 was released in Q1/2020. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (104) |
MediaTek Dimensity 9000 (2) | CPU group | Qualcomm Snapdragon 662/665 (2) |
3 | Generation | 7 |
Cortex-X2 / -A710 / -A510 | Architecture | Kryo 260 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
MediaTek Dimensity 9200 | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 9000+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 9000+ is 3.20 GHz while the Qualcomm Snapdragon 662 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 662 is at 2.00 GHz. |
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MediaTek Dimensity 9000+ | Characteristic | Qualcomm Snapdragon 662 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.20 GHz 1x Cortex-X2 |
A-Core | 2.00 GHz 4x Kryo 260 Gold |
2.85 GHz 3x Cortex-A710 |
B-Core | 1.80 GHz 4x Kryo 260 Silver |
1.80 GHz 4x Cortex-A510 |
C-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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MediaTek Dimensity 9000+ | Characteristic | Qualcomm Snapdragon 662 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 683 |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The MediaTek Dimensity 9000+ or Qualcomm Snapdragon 662 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G710 MP10 | GPU | Qualcomm Adreno 610 |
0.90 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Vallhall 3 | GPU Generation | 6 |
4 nm | Technology | 11 nm |
1 | Max. displays | 0 |
10 | Compute units | -- |
-- | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G710 MP10 | GPU | Qualcomm Adreno 610 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 9000+ can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is 60.0 GB/s. The Qualcomm Snapdragon 662 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 29.8 GB/s. |
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MediaTek Dimensity 9000+ | Characteristic | Qualcomm Snapdragon 662 |
LPDDR5-6400, LPDDR5-7500 | Memory | LPDDR4X-3733, LPDDR3-1866 |
Max. Memory | 8 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
60.0 GB/s | Max. Bandwidth | 29.8 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 9000+ is --, while the Qualcomm Snapdragon 662 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 9000+ | Characteristic | Qualcomm Snapdragon 662 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 9000+ is manufactured in 4 nm and has 0.00 MB cache. The Qualcomm Snapdragon 662 is manufactured in 11 nm and has a 0.00 MB cache. |
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MediaTek Dimensity 9000+ | Characteristic | Qualcomm Snapdragon 662 |
4 nm | Technology | 11 nm |
Chiplet | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2022 | Release date | Q1/2020 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
MediaTek Dimensity 9000+
ARM Mali-G710 MP10 @ 0.90 GHz |
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Qualcomm Snapdragon 662
Qualcomm Adreno 610 @ 0.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
MediaTek Dimensity 9000+
8C 8T @ 3.20 GHz |
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Qualcomm Snapdragon 662
8C 8T @ 2.00 GHz |
Devices using this processor |
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MediaTek Dimensity 9000+ | Qualcomm Snapdragon 662 |
Unknown | Unknown |