MediaTek Dimensity 8000 | Qualcomm Snapdragon 845 | |
CPU comparisonMediaTek Dimensity 8000 or Qualcomm Snapdragon 845 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 8000 has 8 cores with 8 threads and clocks with a maximum frequency of 2.75 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 8000 was released in Q1/2022. The Qualcomm Snapdragon 845 has 8 cores with 8 threads and clocks with a maximum frequency of 2.80 GHz. The CPU supports up to 10 GB of memory in 4 memory channels. The Qualcomm Snapdragon 845 was released in Q1/2018. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (104) |
MediaTek Dimensity 8000 (4) | CPU group | Qualcomm Snapdragon 845/850 (2) |
3 | Generation | 5 |
Cortex-A78 / Cortex-A55 | Architecture | Kryo 385 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 835 |
-- | Successor | Qualcomm Snapdragon 855 |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 8000 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 8000 is 2.75 GHz while the Qualcomm Snapdragon 845 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 845 is at 2.80 GHz. |
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MediaTek Dimensity 8000 | Characteristic | Qualcomm Snapdragon 845 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.75 GHz 4x Cortex-A78 |
A-Core | 2.80 GHz 4x Kryo 385 Gold |
2.00 GHz 4x Cortex-A55 |
B-Core | 1.80 GHz 4x Kryo 385 Silver |
Integrated graphics (iGPU)The MediaTek Dimensity 8000 or Qualcomm Snapdragon 845 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G610 MP6 | GPU | Qualcomm Adreno 630 |
GPU frequency | 0.70 GHz | |
-- | GPU (Turbo) | -- |
Vallhall 3 | GPU Generation | 4 |
4 nm | Technology | 10 nm |
1 | Max. displays | 2 |
6 | Compute units | -- |
-- | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 8 GB |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G610 MP6 | GPU | Qualcomm Adreno 630 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 8000 can use up to 16 GB of memory in 4 memory channels. The maximum memory bandwidth is 51.2 GB/s. The Qualcomm Snapdragon 845 supports up to 10 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 52.0 GB/s. |
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MediaTek Dimensity 8000 | Characteristic | Qualcomm Snapdragon 845 |
LPDDR5-6400 | Memory | LPDDR4X-3733 |
16 GB | Max. Memory | 10 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
51.2 GB/s | Max. Bandwidth | 52.0 GB/s |
No | ECC | No |
-- | L2 Cache | 1.50 MB |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 8000 is --, while the Qualcomm Snapdragon 845 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 8000 | Characteristic | Qualcomm Snapdragon 845 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 8000 is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm Snapdragon 845 is manufactured in 10 nm and has a 3.50 MB cache. |
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MediaTek Dimensity 8000 | Characteristic | Qualcomm Snapdragon 845 |
5 nm | Technology | 10 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2022 | Release date | Q1/2018 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
MediaTek Dimensity 8000
ARM Mali-G610 MP6 @ 0.00 GHz |
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Qualcomm Snapdragon 845
Qualcomm Adreno 630 @ 0.70 GHz |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
MediaTek Dimensity 8000
8C 8T @ 2.75 GHz |
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Qualcomm Snapdragon 845
8C 8T @ 2.80 GHz |
Devices using this processor |
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MediaTek Dimensity 8000 | Qualcomm Snapdragon 845 |
Unknown | OnePlus 6 OnePlus 6T Vivo NEX S Asus Zenfone 5z Razer Phone 2 Asus ROG Phone Sony Xperia XZ2 |