MediaTek Dimensity 7050 | UNISOC T612 | |
CPU comparisonMediaTek Dimensity 7050 or UNISOC T612 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 7050 has 8 cores with 8 threads and clocks with a maximum frequency of 2.60 GHz. Up to 16 GB of memory is supported in 2 memory channels. The MediaTek Dimensity 7050 was released in Q2/2023. The UNISOC T612 has 8 cores with 8 threads and clocks with a maximum frequency of 1.80 GHz. The CPU supports up to GB of memory in 0 memory channels. The UNISOC T612 was released in Q1/2022. |
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Mediatek Dimensity (36) | Family | UNISOC 4G (10) |
MediaTek Dimensity 7000 (3) | CPU group | UNISOC 4G 12nm (8) |
1 | Generation | 0 |
Cortex-A78 / Cortex-A55 | Architecture | -- |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 7050 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 7050 is 2.60 GHz while the UNISOC T612 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the UNISOC T612 is at 1.80 GHz. |
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MediaTek Dimensity 7050 | Characteristic | UNISOC T612 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.60 GHz 2x Cortex-A78 |
A-Core | 1.80 GHz 2x Cortex-A75 |
2.00 GHz 6x Cortex-A55 |
B-Core | 1.80 GHz 6x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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MediaTek Dimensity 7050 | Characteristic | UNISOC T612 |
Mediatek APU | AI hardware | -- |
MediaTek APU 550 | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The MediaTek Dimensity 7050 or UNISOC T612 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G68 MP4 | GPU | ARM Mali-G57 MP1 |
GPU frequency | 0.65 GHz | |
-- | GPU (Turbo) | -- |
Vallhall 2 | GPU Generation | Vallhall 1 |
6 nm | Technology | 7 nm |
1 | Max. displays | 2 |
4 | Compute units | 2 |
64 | Shader | 32 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G68 MP4 | GPU | ARM Mali-G57 MP1 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | Decode |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 7050 can use up to 16 GB of memory in 2 memory channels. The maximum memory bandwidth is 44.0 GB/s. The UNISOC T612 supports up to GB of memory in 0 memory channels and achieves a memory bandwidth of up to --. |
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MediaTek Dimensity 7050 | Characteristic | UNISOC T612 |
LPDDR5-5500, LPDDR4X-4266 | Memory | LPDDR4X-1600 |
16 GB | Max. Memory | |
2 (Dual Channel) | Memory channels | 0 |
44.0 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 7050 is --, while the UNISOC T612 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 7050 | Characteristic | UNISOC T612 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 7050 is manufactured in 6 nm and has 0.00 MB cache. The UNISOC T612 is manufactured in 12 nm and has a 0.00 MB cache. |
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MediaTek Dimensity 7050 | Characteristic | UNISOC T612 |
6 nm | Technology | 12 nm |
Chiplet | Chip design | Unknown |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2023 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 7050
8C 8T @ 2.60 GHz |
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UNISOC T612
8C 8T @ 1.80 GHz |
MediaTek Dimensity 7050
8C 8T @ 2.60 GHz |
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UNISOC T612
8C 8T @ 1.80 GHz |
MediaTek Dimensity 7050
8C 8T @ 2.60 GHz |
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UNISOC T612
8C 8T @ 1.80 GHz |
MediaTek Dimensity 7050
8C 8T @ 2.60 GHz |
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UNISOC T612
8C 8T @ 1.80 GHz |
MediaTek Dimensity 7050
ARM Mali-G68 MP4 @ 0.00 GHz |
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UNISOC T612
ARM Mali-G57 MP1 @ 0.65 GHz |
Devices using this processor |
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MediaTek Dimensity 7050 | UNISOC T612 |
Unknown | Unknown |