MediaTek Dimensity 1200 | Qualcomm Snapdragon 8cx Gen 3 | |
CPU comparisonIn this CPU comparison, we compare the MediaTek Dimensity 1200 and the Qualcomm Snapdragon 8cx Gen 3 and use benchmarks to check which processor is faster.
We compare the MediaTek Dimensity 1200 8 core processor released in Q1/2021 with the Qualcomm Snapdragon 8cx Gen 3 which has 8 CPU cores and was introduced in Q1/2022. |
||
Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (102) |
MediaTek Dimensity 1100/1200/1300 (3) | CPU group | Qualcomm Snapdragon 8cx Gen 3 (1) |
2 | Generation | 3 |
Cortex-A78 / Cortex-A55 | Architecture | Cortex-X1 / Cortex-A78 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 8cx Gen. 2 |
-- | Successor | -- |
|
||
CPU Cores and Base FrequencyThe MediaTek Dimensity 1200 is a 8 core processor with a clock frequency of 3.00 GHz. The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 8cx Gen 3 clocks with 3.00 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
||
MediaTek Dimensity 1200 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.00 GHz 1x Cortex-A78 |
A-Core | 3.00 GHz 4x Kryo 680 Prime |
2.60 GHz 3x Cortex-A78 |
B-Core | 2.42 GHz 4x Kryo 680 Gold |
2.00 GHz 4x Cortex-A55 |
C-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
||
MediaTek Dimensity 1200 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon |
Internal GraphicsGraphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
||
ARM Mali-G77 MP9 | GPU | Qualcomm Adreno 690 |
0.85 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | 6 |
7 nm | Technology | 7 nm |
1 | Max. displays | 0 |
9 | Compute units | -- |
144 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
||
ARM Mali-G77 MP9 | GPU | Qualcomm Adreno 690 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 16 GB of memory in a maximum of 4 memory channels is supported by the MediaTek Dimensity 1200, while the Qualcomm Snapdragon 8cx Gen 3 supports a maximum of 32 GB of memory with a maximum memory bandwidth of 68.2 GB/s enabled. |
||
MediaTek Dimensity 1200 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
LPDDR4X-4266 | Memory | LPDDR4X-4266 |
16 GB | Max. Memory | 32 GB |
4 (Quad Channel) | Memory channels | 8 (Octa Channel) |
34.1 GB/s | Max. Bandwidth | 68.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe MediaTek Dimensity 1200 has a TDP of --. The TDP of the Qualcomm Snapdragon 8cx Gen 3 is 7 W. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
||
MediaTek Dimensity 1200 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
-- | TDP (PL1 / PBP) | 7 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 1200 has 0.00 MB cache and is manufactured in 6 nm. The cache of Qualcomm Snapdragon 8cx Gen 3 is at 0.00 MB. The processor is manufactured in 5 nm. |
||
MediaTek Dimensity 1200 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
6 nm | Technology | 5 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android, Windows 10 (ARM) |
Q1/2021 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
ARM Mali-G77 MP9 @ 0.85 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
Qualcomm Adreno 690 @ 0.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
MediaTek Dimensity 1200
8C 8T @ 3.00 GHz |
|||
Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
Devices using this processor |
|
MediaTek Dimensity 1200 | Qualcomm Snapdragon 8cx Gen 3 |
OnePlus Nord 2 | Unknown |