MediaTek Dimensity 1100 | HiSilicon Kirin 659 | |
CPU comparisonMediaTek Dimensity 1100 or HiSilicon Kirin 659 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 1100 has 8 cores with 8 threads and clocks with a maximum frequency of 2.60 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 1100 was released in Q1/2021. The HiSilicon Kirin 659 has 8 cores with 8 threads and clocks with a maximum frequency of 2.36 GHz. The CPU supports up to GB of memory in 2 memory channels. The HiSilicon Kirin 659 was released in Q2/2016. |
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Mediatek Dimensity (36) | Family | HiSilicon Kirin (29) |
MediaTek Dimensity 1100/1200/1300 (3) | CPU group | HiSilicon Kirin 650 (4) |
2 | Generation | 4 |
Cortex-A78 / Cortex-A55 | Architecture | Cortex-A53 / Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 1100 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 1100 is 2.60 GHz while the HiSilicon Kirin 659 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 659 is at 2.36 GHz. |
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MediaTek Dimensity 1100 | Characteristic | HiSilicon Kirin 659 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.60 GHz 4x Cortex-A78 |
A-Core | 2.36 GHz 4x Cortex-A53 |
2.00 GHz 4x Cortex-A55 |
B-Core | 1.70 GHz 4x Cortex-A53 |
Internal GraphicsThe MediaTek Dimensity 1100 or HiSilicon Kirin 659 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G77 MP9 | GPU | ARM Mali-T830 MP2 |
0.85 GHz | GPU frequency | 0.90 GHz |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | Midgard 4 |
7 nm | Technology | 28nm |
1 | Max. displays | 2 |
9 | Compute units | 2 |
144 | Shader | 32 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G77 MP9 | GPU | ARM Mali-T830 MP2 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 1100 can use up to 16 GB of memory in 4 memory channels. The maximum memory bandwidth is 34.1 GB/s. The HiSilicon Kirin 659 supports up to GB of memory in 2 memory channels and achieves a memory bandwidth of up to --. |
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MediaTek Dimensity 1100 | Characteristic | HiSilicon Kirin 659 |
LPDDR4X-4266 | Memory | LPDDR3-933 |
16 GB | Max. Memory | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
34.1 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 1100 is --, while the HiSilicon Kirin 659 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 1100 | Characteristic | HiSilicon Kirin 659 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 1100 is manufactured in 6 nm and has 0.00 MB cache. The HiSilicon Kirin 659 is manufactured in 16 nm and has a 0.00 MB cache. |
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MediaTek Dimensity 1100 | Characteristic | HiSilicon Kirin 659 |
6 nm | Technology | 16 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2021 | Release date | Q2/2016 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
MediaTek Dimensity 1100
ARM Mali-G77 MP9 @ 0.85 GHz |
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HiSilicon Kirin 659
ARM Mali-T830 MP2 @ 0.90 GHz |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
MediaTek Dimensity 1100
8C 8T @ 2.60 GHz |
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HiSilicon Kirin 659
8C 8T @ 2.36 GHz |
Devices using this processor |
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MediaTek Dimensity 1100 | HiSilicon Kirin 659 |
Unknown | Unknown |