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Intel Xeon Silver 4309Y | HiSilicon Kirin 970 | |
CPU comparisonIntel Xeon Silver 4309Y or HiSilicon Kirin 970 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Intel Xeon Silver 4309Y has 8 cores with 16 threads and clocks with a maximum frequency of 3.60 GHz. Up to 6144 GB of memory is supported in 8 memory channels. The Intel Xeon Silver 4309Y was released in Q2/2021. The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017. |
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Intel Xeon Silver (32) | Family | HiSilicon Kirin (29) |
Intel Xeon Silver 4300 (5) | CPU group | HiSilicon Kirin 970 (1) |
3 | Generation | 6 |
Ice Lake | Architecture | Cortex-A73 / Cortex-A53 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Intel Xeon Silver 4309Y has 8 CPU cores and can calculate 16 threads in parallel. The clock frequency of the Intel Xeon Silver 4309Y is 2.80 GHz (3.60 GHz) while the HiSilicon Kirin 970 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 970 is at 2.40 GHz. |
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Intel Xeon Silver 4309Y | Characteristic | HiSilicon Kirin 970 |
8 | Cores | 8 |
16 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
2.80 GHz (3.60 GHz) | A-Core | 2.40 GHz 4x Cortex-A73 |
-- | B-Core | 1.84 GHz 4x Cortex-A53 |
Integrated graphics (iGPU)The Intel Xeon Silver 4309Y or HiSilicon Kirin 970 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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no iGPU | GPU | ARM Mali-G72 MP12 |
GPU frequency | 0.75 GHz | |
-- | GPU (Turbo) | -- |
-- | GPU Generation | Bifrost 2 |
Technology | 16 nm | |
Max. displays | 1 | |
-- | Compute units | 12 |
-- | Shader | 192 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 2 GB |
-- | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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no iGPU | GPU | ARM Mali-G72 MP12 |
No | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
No | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode / Encode |
No | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
No | Codec AVC | Decode / Encode |
No | Codec VC-1 | Decode / Encode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe Intel Xeon Silver 4309Y can use up to 6144 GB of memory in 8 memory channels. The maximum memory bandwidth is 170.8 GB/s. The HiSilicon Kirin 970 supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Intel Xeon Silver 4309Y | Characteristic | HiSilicon Kirin 970 |
DDR4-2666 | Memory | LPDDR4X-2133 |
6144 GB | Max. Memory | 8 GB |
8 (Octa Channel) | Memory channels | 4 (Quad Channel) |
170.8 GB/s | Max. Bandwidth | -- |
Yes | ECC | No |
-- | L2 Cache | -- |
12.00 MB | L3 Cache | 2.00 MB |
4.0 | PCIe version | -- |
64 | PCIe lanes | -- |
126.0 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Intel Xeon Silver 4309Y is 105 W, while the HiSilicon Kirin 970 has a TDP of 9 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Intel Xeon Silver 4309Y | Characteristic | HiSilicon Kirin 970 |
105 W | TDP (PL1 / PBP) | 9 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Intel Xeon Silver 4309Y is manufactured in 10 nm and has 12.00 MB cache. The HiSilicon Kirin 970 is manufactured in 10 nm and has a 2.00 MB cache. |
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Intel Xeon Silver 4309Y | Characteristic | HiSilicon Kirin 970 |
10 nm | Technology | 10 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4.2, AVX2, AVX-512 | ISA extensions | -- |
LGA 4189 | Socket | -- |
VT-x, VT-x EPT, VT-d | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q2/2021 | Release date | Q3/2017 |
536 $ | Release price | -- |
show more data | show more data | |
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Intel Xeon Silver 4309Y
8C 16T @ 3.60 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Intel Xeon Silver 4309Y
8C 16T @ 2.80 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Intel Xeon Silver 4309Y
8C 16T @ 3.60 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Intel Xeon Silver 4309Y
8C 16T @ 2.80 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Intel Xeon Silver 4309Y
@ 0.00 GHz |
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HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz |
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Intel Xeon Silver 4309Y
8C 16T @ 2.80 GHz |
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HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
Devices using this processor |
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Intel Xeon Silver 4309Y | HiSilicon Kirin 970 |
Unknown | Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4 |