Intel Xeon Platinum 8354H | Qualcomm Snapdragon 425 | |
CPU comparisonIn this CPU comparison, we compare the Intel Xeon Platinum 8354H and the Qualcomm Snapdragon 425 and use benchmarks to check which processor is faster.
We compare the Intel Xeon Platinum 8354H 18 core processor released in Q2/2020 with the Qualcomm Snapdragon 425 which has 4 CPU cores and was introduced in Q3/2016. |
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Intel Xeon Platinum (89) | Family | Qualcomm Snapdragon (103) |
Intel Xeon Platinum 8300 (CL) (10) | CPU group | Qualcomm Snapdragon 425/427 (2) |
3 | Generation | 3 |
Cooper Lake | Architecture | Cortex-A53 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Intel Xeon Platinum 8354H is a 18 core processor with a clock frequency of 3.10 GHz (4.30 GHz). The processor can compute 36 threads at the same time. The Qualcomm Snapdragon 425 clocks with 1.40 GHz, has 4 CPU cores and can calculate 4 threads in parallel. |
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Intel Xeon Platinum 8354H | Characteristic | Qualcomm Snapdragon 425 |
18 | Cores | 4 |
36 | Threads | 4 |
normal | Core architecture | normal |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
3.10 GHz | Frequency | 1.40 GHz |
4.30 GHz | Turbo Frequency (1 Core) | -- |
3.30 GHz | Turbo Frequency (All Cores) | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Intel Xeon Platinum 8354H | Characteristic | Qualcomm Snapdragon 425 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 536 |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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no iGPU | GPU | Qualcomm Adreno 308 |
GPU frequency | 0.50 GHz | |
-- | GPU (Turbo) | 0.50 GHz |
-- | GPU Generation | 3 |
Technology | 28 nm | |
Max. displays | 0 | |
-- | Compute units | -- |
-- | Shader | 24 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
-- | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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no iGPU | GPU | Qualcomm Adreno 308 |
No | Codec h265 / HEVC (8 bit) | Decode |
No | Codec h265 / HEVC (10 bit) | No |
No | Codec h264 | Decode / Encode |
No | Codec VP9 | No |
No | Codec VP8 | No |
No | Codec AV1 | No |
No | Codec AVC | No |
No | Codec VC-1 | Decode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 1146 GB of memory in a maximum of 6 memory channels is supported by the Intel Xeon Platinum 8354H, while the Qualcomm Snapdragon 425 supports a maximum of 4 GB of memory with a maximum memory bandwidth of 10.7 GB/s enabled. |
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Intel Xeon Platinum 8354H | Characteristic | Qualcomm Snapdragon 425 |
DDR4-3200 | Memory | LPDDR3-1333 |
1146 GB | Max. Memory | 4 GB |
6 (Hexa Channel) | Memory channels | 2 (Dual Channel) |
153.6 GB/s | Max. Bandwidth | 10.7 GB/s |
Yes | ECC | No |
-- | L2 Cache | -- |
24.75 MB | L3 Cache | -- |
3.0 | PCIe version | -- |
48 | PCIe lanes | -- |
47.3 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe Intel Xeon Platinum 8354H has a TDP of 205 W. The TDP of the Qualcomm Snapdragon 425 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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Intel Xeon Platinum 8354H | Characteristic | Qualcomm Snapdragon 425 |
205 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Intel Xeon Platinum 8354H has 24.75 MB cache and is manufactured in 14 nm. The cache of Qualcomm Snapdragon 425 is at 0.00 MB. The processor is manufactured in 28 nm. |
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Intel Xeon Platinum 8354H | Characteristic | Qualcomm Snapdragon 425 |
14 nm | Technology | 28 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4.1, SSE4.2, AVX2, AVX-512 | ISA extensions | -- |
LGA 4189 | Socket | -- |
VT-x, VT-x EPT, VT-d | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q2/2020 | Release date | Q3/2016 |
-- | Release price | -- |
show more data | show more data | |
Intel Xeon Platinum 8354H
18C 36T @ 4.30 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
Intel Xeon Platinum 8354H
18C 36T @ 3.30 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
Intel Xeon Platinum 8354H
18C 36T @ 4.30 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
Intel Xeon Platinum 8354H
18C 36T @ 3.30 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
Intel Xeon Platinum 8354H
@ 0.00 GHz |
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Qualcomm Snapdragon 425
Qualcomm Adreno 308 @ 0.50 GHz |
Intel Xeon Platinum 8354H
18C 36T @ 3.30 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
Devices using this processor |
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Intel Xeon Platinum 8354H | Qualcomm Snapdragon 425 |
Unknown | Unknown |