Intel Xeon E3-1240 v6 | Qualcomm Snapdragon 670 | |
CPU comparisonIn this CPU comparison, we compare the Intel Xeon E3-1240 v6 and the Qualcomm Snapdragon 670 and use benchmarks to check which processor is faster.
We compare the Intel Xeon E3-1240 v6 4 core processor released in Q1/2017 with the Qualcomm Snapdragon 670 which has 8 CPU cores and was introduced in Q3/2018. |
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Intel Xeon E3 (43) | Family | Qualcomm Snapdragon (104) |
Intel Xeon E3 v6 (10) | CPU group | Qualcomm Snapdragon 670 (1) |
6 | Generation | 6 |
Kaby Lake S | Architecture | Kryo 360 |
Desktop / Server | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Intel Xeon E3-1240 v6 is a 4 core processor with a clock frequency of 3.70 GHz (4.10 GHz). The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 670 clocks with 2.00 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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Intel Xeon E3-1240 v6 | Characteristic | Qualcomm Snapdragon 670 |
4 | Cores | 8 |
8 | Threads | 8 |
normal | Core architecture | hybrid (big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
3.70 GHz (4.10 GHz) | A-Core | 2.00 GHz 2x Kryo 360 Gold |
-- | B-Core | 1.70 GHz 6x Kryo 360 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Intel Xeon E3-1240 v6 | Characteristic | Qualcomm Snapdragon 670 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 685 @ 3 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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no iGPU | GPU | Qualcomm Adreno 615 |
GPU frequency | 0.70 GHz | |
-- | GPU (Turbo) | 0.70 GHz |
-- | GPU Generation | 6 |
Technology | 10 nm | |
Max. displays | 0 | |
-- | Compute units | -- |
-- | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
-- | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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no iGPU | GPU | Qualcomm Adreno 615 |
No | Codec h265 / HEVC (8 bit) | Decode |
No | Codec h265 / HEVC (10 bit) | Decode |
No | Codec h264 | Decode |
No | Codec VP9 | Decode |
No | Codec VP8 | Decode |
No | Codec AV1 | No |
No | Codec AVC | Decode |
No | Codec VC-1 | Decode |
No | Codec JPEG | Decode |
Memory & PCIeUp to 64 GB of memory in a maximum of 2 memory channels is supported by the Intel Xeon E3-1240 v6, while the Qualcomm Snapdragon 670 supports a maximum of 8 GB of memory with a maximum memory bandwidth of 14.9 GB/s enabled. |
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Intel Xeon E3-1240 v6 | Characteristic | Qualcomm Snapdragon 670 |
DDR4-2400 | Memory | LPDDR4X-3733 |
64 GB | Max. Memory | 8 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
38.4 GB/s | Max. Bandwidth | 14.9 GB/s |
Yes | ECC | No |
-- | L2 Cache | -- |
8.00 MB | L3 Cache | -- |
3.0 | PCIe version | -- |
16 | PCIe lanes | -- |
15.8 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe Intel Xeon E3-1240 v6 has a TDP of 72 W. The TDP of the Qualcomm Snapdragon 670 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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Intel Xeon E3-1240 v6 | Characteristic | Qualcomm Snapdragon 670 |
72 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Intel Xeon E3-1240 v6 has 8.00 MB cache and is manufactured in 14 nm. The cache of Qualcomm Snapdragon 670 is at 0.00 MB. The processor is manufactured in 10 nm. |
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Intel Xeon E3-1240 v6 | Characteristic | Qualcomm Snapdragon 670 |
14 nm | Technology | 10 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4.1, SSE4.2, AVX2 | ISA extensions | -- |
LGA 1151 | Socket | -- |
VT-x, VT-x EPT, VT-d | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q1/2017 | Release date | Q3/2018 |
195 $ | Release price | -- |
show more data | show more data | |
Intel Xeon E3-1240 v6
4C 8T @ 4.10 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 3.90 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 4.10 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 3.90 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 3.90 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
@ 0.00 GHz |
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Qualcomm Snapdragon 670
Qualcomm Adreno 615 @ 0.70 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 3.70 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 4.10 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 3.90 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Intel Xeon E3-1240 v6
4C 8T @ 3.70 GHz |
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Qualcomm Snapdragon 670
8C 8T @ 2.00 GHz |
Devices using this processor |
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Intel Xeon E3-1240 v6 | Qualcomm Snapdragon 670 |
Unknown | Unknown |