Intel Core i3-10105 vs Qualcomm Snapdragon 670 Benchmark, comparison and differences


Intel Core i3-10105		Qualcomm Snapdragon 670
CPU comparison Intel Core i3-10105 or Qualcomm Snapdragon 670 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results. The Intel Core i3-10105 has 4 cores with 8 threads and clocks with a maximum frequency of 4.40 GHz. Up to 128 GB of memory is supported in 2 memory channels. The Intel Core i3-10105 was released in Q1/2021. The Qualcomm Snapdragon 670 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 670 was released in Q3/2018.

Intel Core i3 (205)	Family	Qualcomm Snapdragon (102)
Intel Core i 10000 (43)	CPU group	Qualcomm Snapdragon 670 (1)
10	Generation	6
Comet Lake S	Architecture	Kryo 360
Desktop / Server	Segment	Mobile
--	Predecessor	--
--	Successor	--

CPU Cores and Base Frequency The Intel Core i3-10105 has 4 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Intel Core i3-10105 is 3.70 GHz (4.40 GHz) while the Qualcomm Snapdragon 670 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 670 is at 2.00 GHz.
Intel Core i3-10105	Characteristic	Qualcomm Snapdragon 670
4	Cores	8
8	Threads	8
normal	Core architecture	hybrid (big.LITTLE)
Yes	Hyperthreading	No
No	Overclocking ?	No
3.70 GHz (4.40 GHz)	A-Core	2.00 GHz 2x Kryo 360 Gold
--	B-Core	1.70 GHz 6x Kryo 360 Silver
Artificial Intelligence and Machine Learning Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor.
Intel Core i3-10105	Characteristic	Qualcomm Snapdragon 670
--	AI hardware	Qualcomm AI engine
--	AI specifications	Hexagon 685 @ 3 TOPS

Internal Graphics The Intel Core i3-10105 or Qualcomm Snapdragon 670 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.
Intel UHD Graphics 630	GPU	Qualcomm Adreno 615
0.35 GHz	GPU frequency	0.70 GHz
1.10 GHz	GPU (Turbo)	0.70 GHz
9.5	GPU Generation	6
14 nm	Technology	10 nm
3	Max. displays	0
24	Compute units	--
192	Shader	256
No	Hardware Raytracing	No
No	Frame Generation	No
64 GB	Max. GPU Memory	--
12	DirectX Version	12.1

Hardware codec support A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.
Intel UHD Graphics 630	GPU	Qualcomm Adreno 615
Decode / Encode	Codec h265 / HEVC (8 bit)	Decode
Decode / Encode	Codec h265 / HEVC (10 bit)	Decode
Decode / Encode	Codec h264	Decode
Decode / Encode	Codec VP9	Decode
Decode / Encode	Codec VP8	Decode
No	Codec AV1	No
Decode / Encode	Codec AVC	Decode
Decode	Codec VC-1	Decode
Decode / Encode	Codec JPEG	Decode

Memory & PCIe The Intel Core i3-10105 can use up to 128 GB of memory in 2 memory channels. The maximum memory bandwidth is 42.7 GB/s. The Qualcomm Snapdragon 670 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 14.9 GB/s.
Intel Core i3-10105	Characteristic	Qualcomm Snapdragon 670
DDR4-2666	Memory	LPDDR4X-3733
128 GB	Max. Memory	8 GB
2 (Dual Channel)	Memory channels	2 (Dual Channel)
42.7 GB/s	Max. Bandwidth	14.9 GB/s
No	ECC	No
--	L2 Cache	--
6.00 MB	L3 Cache	--
3.0	PCIe version	--
16	PCIe lanes	--
15.8 GB/s	PCIe Bandwidth	--
Thermal Management The thermal design power (TDP for short) of the Intel Core i3-10105 is 65 W, while the Qualcomm Snapdragon 670 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.
Intel Core i3-10105	Characteristic	Qualcomm Snapdragon 670
65 W	TDP (PL1 / PBP)	--
--	TDP (PL2)	--
--	TDP up	--
--	TDP down	--
100 °C	Tjunction max.	--
Technical details The Intel Core i3-10105 is manufactured in 14 nm and has 6.00 MB cache. The Qualcomm Snapdragon 670 is manufactured in 10 nm and has a 0.00 MB cache.
Intel Core i3-10105	Characteristic	Qualcomm Snapdragon 670
14 nm	Technology	10 nm
Monolithic	Chip design	Chiplet
x86-64 (64 bit)	Instruction set (ISA)	Armv8-A (64 bit)
SSE4.1, SSE4.2, AVX2	ISA extensions	--
LGA 1200	Socket	--
VT-x, VT-x EPT, VT-d	Virtualization	None
Yes	AES-NI	No
Windows 10, Windows 11, Linux	Operating systems	Android
Q1/2021	Release date	Q3/2018
134 $	Release price	--

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Intel Core i3-10105 4C 8T @ 3.70 GHz (4.40 GHz) buy now on Amazon and save! Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz buy now on Amazon and save!

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Average performance in benchmarks

⌀ Single core performance in 2 CPU benchmarks

Intel Core i3-10105 (100%)

Qualcomm Snapdragon 670 (28%)

⌀ Multi core performance in 3 CPU benchmarks

Intel Core i3-10105 (100%)

Qualcomm Snapdragon 670 (27%)

Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.


	Intel Core i3-10105 4C 8T @ 4.40 GHz	1160 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	333 (29%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.


	Intel Core i3-10105 4C 8T @ 4.20 GHz	4501 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	1234 (27%)

Geekbench 6 (Single-Core)

Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The single-core benchmark only evaluates the performance of the fastest CPU core, the number of CPU cores in a processor is irrelevant here.


	Intel Core i3-10105 4C 8T @ 4.40 GHz	1470 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	375 (26%)

Geekbench 6 (Multi-Core)

Geekbench 6 is a benchmark for modern computers, notebooks and smartphones. What is new is an optimized utilization of newer CPU architectures, e.g. based on the big.LITTLE concept and combining CPU cores of different sizes. The multi-core benchmark evaluates the performance of all of the processor's CPU cores. Virtual thread improvements such as AMD SMT or Intel's Hyper-Threading have a positive impact on the benchmark result.


	Intel Core i3-10105 4C 8T @ 4.20 GHz	4896 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	1284 (26%)

iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.


	Intel Core i3-10105 Intel UHD Graphics 630 @ 1.10 GHz	422 (100%)
	Qualcomm Snapdragon 670 Qualcomm Adreno 615 @ 0.70 GHz	358 (85%)

Estimated results for PassMark CPU Mark

Some of the CPUs listed below have been benchmarked by CPU-monkey. However the majority of CPUs have not been tested and the results have been estimated by a CPU-monkey’s secret proprietary formula. As such they do not accurately reflect the actual Passmark CPU mark values and are not endorsed by PassMark Software Pty Ltd.


	Intel Core i3-10105 4C 8T @ 4.20 GHz	8731 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	2491 (29%)

Cinebench 2024 (Single-Core)

The Cinebench 2024 benchmark is based on the Redshift rendering engine, which is also used in Maxon's 3D program Cinema 4D. The benchmark runs are each 10 minutes long to test whether the processor is limited by its heat generation.


	Intel Core i3-10105 4C 8T @ 4.40 GHz	66 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

Cinebench 2024 (Multi-Core)

The Multi-Core test of the Cinebench 2024 benchmark uses all cpu cores to render using the Redshift rendering engine, which is also used in Maxons Cinema 4D. The benchmark run is 10 minutes long to test whether the processor is limited by its heat generation.


	Intel Core i3-10105 4C 8T @ 4.40 GHz	298 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

Cinebench R23 (Single-Core)

Cinebench R23 is the successor of Cinebench R20 and is also based on the Cinema 4 Suite. Cinema 4 is a worldwide used software to create 3D forms. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.


	Intel Core i3-10105 4C 8T @ 4.40 GHz	1168 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

Cinebench R23 (Multi-Core)

Cinebench R23 is the successor of Cinebench R20 and is also based on the Cinema 4 Suite. Cinema 4 is a worldwide used software to create 3D forms. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.


	Intel Core i3-10105 4C 8T @ 4.20 GHz	5737 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

Cinebench R20 (Single-Core)

Cinebench R20 is the successor of Cinebench R15 and is also based on the Cinema 4 Suite. Cinema 4 is a worldwide used software to create 3D forms. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.


	Intel Core i3-10105 4C 8T @ 4.40 GHz	459 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

Cinebench R20 (Multi-Core)

Cinebench R20 is the successor of Cinebench R15 and is also based on the Cinema 4 Suite. Cinema 4 is a worldwide used software to create 3D forms. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.


	Intel Core i3-10105 4C 8T @ 4.20 GHz	2337 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

AnTuTu 8 Benchmark

The AnTuTu 8 Benchmark measures the performance of a SoC. AnTuTu benchmarks the CPU, GPU, Memory as well as the UX (User Experience) by simulating browser and app usage. AnTuTu can benchmark any ARM CPU that runs under Android or iOS. Devices may not be directly compareable if the benchmark has been performed under different operating systems.

In the AnTuTu 8 benchmark, the single-core performance of a processor is only slightly weighted. The evaluation consists of the multi-core performance of the processor, the speed of the RAM and the performance of the internal graphics.


	Intel Core i3-10105 4C 8T @ 3.70 GHz	0 (0%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	175698 (100%)

Blender 3.1 Benchmark

In the Blender Benchmark 3.1, the scenes "monster", "junkshop" and "classroom" are rendered and the time required by the system is measured. In our benchmark we test the CPU and not the graphics card. Blender 3.1 was presented as a standalone version in March 2022.


	Intel Core i3-10105 4C 8T @ 4.20 GHz	86 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

CPU-Z Benchmark 17 (Multi-Core)

The CPU-Z benchmark measures a processor's performance by measuring the time it takes the system to complete all benchmark calculations. The faster the benchmark is completed, the higher the score.


	Intel Core i3-10105 4C 8T @ 3.70 GHz	2497 (100%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	0 (0%)

Performance for Artificial Intelligence (AI) and Machine Learning (ML)

Processors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. The performance is given in the number (trillions) of arithmetic operations per second (TOPS).


	Intel Core i3-10105 4C 8T @ 3.70 GHz	0 (0%)
	Qualcomm Snapdragon 670 8C 8T @ 2.00 GHz	3 (100%)

Devices using this processor
Intel Core i3-10105	Qualcomm Snapdragon 670
Unknown	Unknown


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Intel Core i3-10105 vs Qualcomm Snapdragon 670

CPU comparison with benchmarks

CPU comparison

CPU Cores and Base Frequency

Artificial Intelligence and Machine Learning

Internal Graphics

Hardware codec support

Memory & PCIe

Thermal Management

Technical details