HiSilicon Kirin 990 5G | MediaTek Dimensity 800 | |
CPU comparisonHiSilicon Kirin 990 5G or MediaTek Dimensity 800 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 990 5G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 990 5G was released in Q3/2019. The MediaTek Dimensity 800 has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. The CPU supports up to GB of memory in 2 memory channels. The MediaTek Dimensity 800 was released in Q2/2020. |
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HiSilicon Kirin (29) | Family | Mediatek Dimensity (36) |
HiSilicon Kirin 990 (3) | CPU group | MediaTek Dimensity 700/720/800 (4) |
8 | Generation | 1 |
Cortex-A76 / Cortex-A55 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 990 5G is a 8 core processor with a clock frequency of 2.86 GHz. The MediaTek Dimensity 800 has 8 CPU cores with a clock frequency of 2.00 GHz. |
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HiSilicon Kirin 990 5G | Characteristic | MediaTek Dimensity 800 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.86 GHz 2x Cortex-A76 |
A-Core | 2.00 GHz 4x Cortex-A76 |
2.36 GHz 2x Cortex-A76 |
B-Core | 2.00 GHz 4x Cortex-A55 |
1.95 GHz 4x Cortex-A55 |
C-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 990 5G | Characteristic | MediaTek Dimensity 800 |
HUAWEI HiAI 2.0 | AI hardware | -- |
Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny | AI specifications | -- |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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ARM Mali-G76 MP16 | GPU | ARM Mali-G57 MP3 |
0.60 GHz | GPU frequency | 0.95 GHz |
-- | GPU (Turbo) | -- |
Bifrost 3 | GPU Generation | Vallhall 1 |
7 nm | Technology | 7 nm |
2 | Max. displays | 2 |
16 | Compute units | 3 |
256 | Shader | 48 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G76 MP16 | GPU | ARM Mali-G57 MP3 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 990 5G supports a maximum of 8 GB of memory in 4 memory channels. The MediaTek Dimensity 800 can connect up to GB of memory in 2 memory channels. |
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HiSilicon Kirin 990 5G | Characteristic | MediaTek Dimensity 800 |
LPDDR4X-4266 | Memory | LPDDR4X-4266 |
8 GB | Max. Memory | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 17.1 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The HiSilicon Kirin 990 5G has a TDP of 6 W, that of the MediaTek Dimensity 800 is --. |
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HiSilicon Kirin 990 5G | Characteristic | MediaTek Dimensity 800 |
6 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 990 5G has a 2.00 MB cache, while the MediaTek Dimensity 800 cache has a total of 0.00 MB. |
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HiSilicon Kirin 990 5G | Characteristic | MediaTek Dimensity 800 |
7 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2019 | Release date | Q2/2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
HiSilicon Kirin 990 5G
ARM Mali-G76 MP16 @ 0.60 GHz |
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MediaTek Dimensity 800
ARM Mali-G57 MP3 @ 0.95 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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MediaTek Dimensity 800
8C 8T @ 2.00 GHz |
Devices using this processor |
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HiSilicon Kirin 990 5G | MediaTek Dimensity 800 |
Unknown | Unknown |