HiSilicon Kirin 990 4G | Qualcomm Snapdragon 730G | |
CPU comparisonHiSilicon Kirin 990 4G or Qualcomm Snapdragon 730G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 990 4G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 990 4G was released in Q3/2019. The Qualcomm Snapdragon 730G has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 730G was released in Q2/2019. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 990 (3) | CPU group | Qualcomm Snapdragon 730 (3) |
8 | Generation | 2 |
Cortex-A76 / Cortex-A55 | Architecture | Kryo 470 Gold/475 Silver |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 990 4G has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 990 4G is 2.86 GHz while the Qualcomm Snapdragon 730G has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 730G is at 2.20 GHz. |
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HiSilicon Kirin 990 4G | Characteristic | Qualcomm Snapdragon 730G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.86 GHz 2x Cortex-A76 |
A-Core | 2.20 GHz 2x Kryo 470 Gold |
2.09 GHz 2x Cortex-A76 |
B-Core | 1.80 GHz 6x Kryo 470 Silver |
1.86 GHz 4x Cortex-A55 |
C-Core | -- |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 990 4G | Characteristic | Qualcomm Snapdragon 730G |
HUAWEI HiAI 2.0 | AI hardware | Qualcomm AI engine |
Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny | AI specifications | Hexagon 688 @ 3.6 TOPS |
Internal GraphicsThe HiSilicon Kirin 990 4G or Qualcomm Snapdragon 730G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G76 MP16 | GPU | Qualcomm Adreno 618 |
0.60 GHz | GPU frequency | 0.83 GHz |
-- | GPU (Turbo) | -- |
Bifrost 3 | GPU Generation | 6 |
7 nm | Technology | 14 nm |
2 | Max. displays | 2 |
16 | Compute units | -- |
256 | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G76 MP16 | GPU | Qualcomm Adreno 618 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 990 4G can use up to 8 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 730G supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 14.9 GB/s. |
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HiSilicon Kirin 990 4G | Characteristic | Qualcomm Snapdragon 730G |
LPDDR4X-2133 | Memory | LPDDR4X-3733 |
8 GB | Max. Memory | 8 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 14.9 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 990 4G is 6 W, while the Qualcomm Snapdragon 730G has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 990 4G | Characteristic | Qualcomm Snapdragon 730G |
6 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 990 4G is manufactured in 7 nm and has 2.00 MB cache. The Qualcomm Snapdragon 730G is manufactured in 8 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 990 4G | Characteristic | Qualcomm Snapdragon 730G |
7 nm | Technology | 8 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2019 | Release date | Q2/2019 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
HiSilicon Kirin 990 4G
ARM Mali-G76 MP16 @ 0.60 GHz |
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Qualcomm Snapdragon 730G
Qualcomm Adreno 618 @ 0.83 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 730G
8C 8T @ 2.20 GHz |
Devices using this processor |
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HiSilicon Kirin 990 4G | Qualcomm Snapdragon 730G |
Huawei Mate 30 Pro | Oppo Reno2 Xiaomi Mi Note 10 |