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HiSilicon Kirin 980 | Qualcomm Snapdragon 8cx Gen 3 | |
CPU comparisonIn this CPU comparison, we compare the HiSilicon Kirin 980 and the Qualcomm Snapdragon 8cx Gen 3 and use benchmarks to check which processor is faster.
We compare the HiSilicon Kirin 980 8 core processor released in Q4/2018 with the Qualcomm Snapdragon 8cx Gen 3 which has 8 CPU cores and was introduced in Q1/2022. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 980 (2) | CPU group | Qualcomm Snapdragon 8cx Gen 3 (1) |
7 | Generation | 3 |
Cortex-A76 / Cortex-A55 | Architecture | Cortex-X1 / Cortex-A78 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 8cx Gen. 2 |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 980 is a 8 core processor with a clock frequency of 2.60 GHz. The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 8cx Gen 3 clocks with 3.00 GHz, has 8 CPU cores and can calculate 8 threads in parallel. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.60 GHz 2x Cortex-A76 |
A-Core | 3.00 GHz 4x Kryo 680 Prime |
1.92 GHz 2x Cortex-A76 |
B-Core | 2.42 GHz 4x Kryo 680 Gold |
1.80 GHz 4x Cortex-A55 |
C-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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ARM Mali-G76 MP10 | GPU | Qualcomm Adreno 690 |
0.72 GHz | GPU frequency | -- |
-- | GPU (Turbo) | -- |
Bifrost 3 | GPU Generation | 6 |
7 nm | Technology | 7 nm |
2 | Max. displays | 0 |
10 | Compute units | -- |
160 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G76 MP10 | GPU | Qualcomm Adreno 690 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to 8 GB of memory in a maximum of 4 memory channels is supported by the HiSilicon Kirin 980, while the Qualcomm Snapdragon 8cx Gen 3 supports a maximum of 32 GB of memory with a maximum memory bandwidth of 68.2 GB/s enabled. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
LPDDR4X-2133 | Memory | LPDDR4X-4266 |
8 GB | Max. Memory | 32 GB |
4 (Quad Channel) | Memory channels | 8 (Octa Channel) |
-- | Max. Bandwidth | 68.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
2.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe HiSilicon Kirin 980 has a TDP of 6 W. The TDP of the Qualcomm Snapdragon 8cx Gen 3 is 7 W. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
6 W | TDP (PL1 / PBP) | 7 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 980 has 2.00 MB cache and is manufactured in 7 nm. The cache of Qualcomm Snapdragon 8cx Gen 3 is at 0.00 MB. The processor is manufactured in 5 nm. |
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HiSilicon Kirin 980 | Characteristic | Qualcomm Snapdragon 8cx Gen 3 |
7 nm | Technology | 5 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android, Windows 10 (ARM) |
Q4/2018 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
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HiSilicon Kirin 980
ARM Mali-G76 MP10 @ 0.72 GHz |
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Qualcomm Snapdragon 8cx Gen 3
Qualcomm Adreno 690 @ 0.00 GHz |
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HiSilicon Kirin 980
8C 8T @ 2.60 GHz |
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Qualcomm Snapdragon 8cx Gen 3
8C 8T @ 3.00 GHz |
Devices using this processor |
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HiSilicon Kirin 980 | Qualcomm Snapdragon 8cx Gen 3 |
Huawei P30 Huawei P30 Pro Huawei Honor 20 Huawei Honor 20 Pro Huawei Mate 20 Huawei Mate 20 Pro Huawei Nova 5T |
Unknown |