HiSilicon Kirin 970 | Qualcomm Snapdragon 8 Gen 1 | |
CPU comparisonHiSilicon Kirin 970 or Qualcomm Snapdragon 8 Gen 1 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017. The Qualcomm Snapdragon 8 Gen 1 has 8 cores with 8 threads and clocks with a maximum frequency of 3.00 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 8 Gen 1 was released in Q1/2022. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (102) |
HiSilicon Kirin 970 (1) | CPU group | Qualcomm Snapdragon 7/8 Gen 1 (3) |
6 | Generation | 1 |
Cortex-A73 / Cortex-A53 | Architecture | Cortex-X2 / -A710 / -A510 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 888 |
-- | Successor | Qualcomm Snapdragon 8 Gen 2 |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 970 is a 8 core processor with a clock frequency of 2.40 GHz. The Qualcomm Snapdragon 8 Gen 1 has 8 CPU cores with a clock frequency of 3.00 GHz. |
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HiSilicon Kirin 970 | Characteristic | Qualcomm Snapdragon 8 Gen 1 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 4x Cortex-A73 |
A-Core | 3.00 GHz 1x Kryo Prime |
1.84 GHz 4x Cortex-A53 |
B-Core | 2.50 GHz 3x Kryo Gold |
-- | C-Core | 1.80 GHz 4x Kryo Silver |
Artificial Intelligence and Machine LearningProcessors with the support of artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. Algorithms for ML improve their performance the more data they have collected via software. ML tasks can be processed up to 10,000 times faster than with a classic processor. |
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HiSilicon Kirin 970 | Characteristic | Qualcomm Snapdragon 8 Gen 1 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 780 @ 26 TOPS |
Internal GraphicsThe integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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ARM Mali-G72 MP12 | GPU | Qualcomm Adreno 730 |
0.75 GHz | GPU frequency | 0.82 GHz |
-- | GPU (Turbo) | -- |
Bifrost 2 | GPU Generation | 7 |
16 nm | Technology | 4 nm |
1 | Max. displays | 0 |
12 | Compute units | -- |
192 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
2 GB | Max. GPU Memory | 8 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G72 MP12 | GPU | Qualcomm Adreno 730 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 970 supports a maximum of 8 GB of memory in 4 memory channels. The Qualcomm Snapdragon 8 Gen 1 can connect up to 16 GB of memory in 4 memory channels. |
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HiSilicon Kirin 970 | Characteristic | Qualcomm Snapdragon 8 Gen 1 |
LPDDR4X-2133 | Memory | LPDDR5-6400 |
8 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | 2.00 MB |
2.00 MB | L3 Cache | 6.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The HiSilicon Kirin 970 has a TDP of 9 W, that of the Qualcomm Snapdragon 8 Gen 1 is --. |
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HiSilicon Kirin 970 | Characteristic | Qualcomm Snapdragon 8 Gen 1 |
9 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 970 has a 2.00 MB cache, while the Qualcomm Snapdragon 8 Gen 1 cache has a total of 8.00 MB. |
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HiSilicon Kirin 970 | Characteristic | Qualcomm Snapdragon 8 Gen 1 |
10 nm | Technology | 4 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv9-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android, Windows 10 (ARM) |
Q3/2017 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz |
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Qualcomm Snapdragon 8 Gen 1
Qualcomm Adreno 730 @ 0.82 GHz |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
HiSilicon Kirin 970
8C 8T @ 2.40 GHz |
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Qualcomm Snapdragon 8 Gen 1
8C 8T @ 3.00 GHz |
Devices using this processor |
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HiSilicon Kirin 970 | Qualcomm Snapdragon 8 Gen 1 |
Huawei Honor 10 Huawei Note 10 Huawei Play Huawei Honor View 10 Huawei Mate 10 Pro Huawei P20 Huawei Nova 3 Huawei Nova 4 |
Xiaomi 12 Pro |