HiSilicon Kirin 970 vs Qualcomm Snapdragon 7 Gen 1

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CPU comparison with benchmarks


HiSilicon Kirin 970 CPU1 vs CPU2 Qualcomm Snapdragon 7 Gen 1
HiSilicon Kirin 970 Qualcomm Snapdragon 7 Gen 1

CPU comparison

HiSilicon Kirin 970 or Qualcomm Snapdragon 7 Gen 1 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The HiSilicon Kirin 970 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 970 was released in Q3/2017.

The Qualcomm Snapdragon 7 Gen 1 has 6 cores with 6 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 7 Gen 1 was released in Q2/2022.
HiSilicon Kirin (29) Family Qualcomm Snapdragon (104)
HiSilicon Kirin 970 (1) CPU group Qualcomm Snapdragon 7/8 Gen 1 (3)
6 Generation 1
Cortex-A73 / Cortex-A53 Architecture Cortex-X2 / -A710 / -A510
Mobile Segment Mobile
-- Predecessor --
-- Successor Qualcomm Snapdragon 7+ Gen 2

CPU Cores and Base Frequency

The HiSilicon Kirin 970 is a 8 core processor with a clock frequency of 2.40 GHz. The Qualcomm Snapdragon 7 Gen 1 has 6 CPU cores with a clock frequency of 2.40 GHz.

HiSilicon Kirin 970 Characteristic Qualcomm Snapdragon 7 Gen 1
8 Cores 6
8 Threads 6
hybrid (big.LITTLE) Core architecture hybrid (Prime / big.LITTLE)
No Hyperthreading No
No Overclocking ? No
2.40 GHz
4x Cortex-A73
A-Core 2.40 GHz
1x Kryo 710 Prime
1.84 GHz
4x Cortex-A53
B-Core 2.36 GHz
3x Kryo 710 Gold
-- C-Core 1.80 GHz
3x Kryo 510 Silver

NPU AI performance

The performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors.

HiSilicon Kirin 970 Characteristic Qualcomm Snapdragon 7 Gen 1
-- AI hardware --
-- AI specifications --
-- NPU + CPU + iGPU --

Integrated graphics (iGPU)

The integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs.

ARM Mali-G72 MP12 GPU Qualcomm Adreno 644
0.75 GHz GPU frequency 0.44 GHz
-- GPU (Turbo) 0.44 GHz
Bifrost 2 GPU Generation --
16 nm Technology 4 nm
1 Max. displays 1
12 Compute units --
192 Shader --
No Hardware Raytracing No
No Frame Generation No
2 GB Max. GPU Memory --
12 DirectX Version 12.0

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

ARM Mali-G72 MP12 GPU Qualcomm Adreno 644
Decode / Encode Codec h265 / HEVC (8 bit) Decode / Encode
Decode / Encode Codec h265 / HEVC (10 bit) Decode / Encode
Decode / Encode Codec h264 Decode / Encode
Decode / Encode Codec VP9 Decode / Encode
Decode / Encode Codec VP8 Decode / Encode
No Codec AV1 No
Decode / Encode Codec AVC Decode
Decode / Encode Codec VC-1 Decode
Decode / Encode Codec JPEG Decode / Encode

Memory & PCIe

The HiSilicon Kirin 970 supports a maximum of 8 GB of memory in 4 memory channels. The Qualcomm Snapdragon 7 Gen 1 can connect up to 16 GB of memory in 2 memory channels.

HiSilicon Kirin 970 Characteristic Qualcomm Snapdragon 7 Gen 1
LPDDR4X-2133 Memory LPDDR5-6400
8 GB Max. Memory 16 GB
4 (Quad Channel) Memory channels 2 (Dual Channel)
-- Max. Bandwidth 102.4 GB/s
No ECC No
-- L2 Cache 3.00 MB
2.00 MB L3 Cache --
-- PCIe version --
-- PCIe lanes --
-- PCIe Bandwidth --

Thermal Management

The TDP (Thermal Design Power) of a processor specifies the required cooling solution. The HiSilicon Kirin 970 has a TDP of 9 W, that of the Qualcomm Snapdragon 7 Gen 1 is 8 W.

HiSilicon Kirin 970 Characteristic Qualcomm Snapdragon 7 Gen 1
9 W TDP (PL1 / PBP) 8 W
-- TDP (PL2) --
-- TDP up --
-- TDP down --
-- Tjunction max. --

Technical details

The HiSilicon Kirin 970 has a 2.00 MB cache, while the Qualcomm Snapdragon 7 Gen 1 cache has a total of 3.00 MB.

HiSilicon Kirin 970 Characteristic Qualcomm Snapdragon 7 Gen 1
10 nm Technology 4 nm
Chiplet Chip design Chiplet
Armv8-A (64 bit) Instruction set (ISA) Armv9-A (64 bit)
-- ISA extensions --
-- Socket --
None Virtualization None
No AES-NI No
Android Operating systems Android, Windows 10 (ARM)
Q3/2017 Release date Q2/2022
-- Release price --
show more data show more data


Rate these processors

Here you can rate the HiSilicon Kirin 970 to help other visitors make their purchasing decisions. The average rating is 5.0 stars (5 ratings). Rate now:
Here you can rate the Qualcomm Snapdragon 7 Gen 1 to help other visitors make their purchasing decisions. The average rating is 4.7 stars (10 ratings). Rate now:


Average performance in benchmarks

⌀ Single core performance in 1 CPU benchmarks
HiSilicon Kirin 970 (44%)
Qualcomm Snapdragon 7 Gen 1 (100%)
⌀ Multi core performance in 1 CPU benchmarks
HiSilicon Kirin 970 (50%)
Qualcomm Snapdragon 7 Gen 1 (100%)

Geekbench 5, 64bit (Single-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The single-core test only uses one CPU core, the amount of cores or hyperthreading ability doesn't count.
HiSilicon Kirin 970 HiSilicon Kirin 970
8C 8T @ 2.40 GHz
349 (44%)
Qualcomm Snapdragon 7 Gen 1 Qualcomm Snapdragon 7 Gen 1
6C 6T @ 2.40 GHz
788 (100%)

Geekbench 5, 64bit (Multi-Core)

Geekbench 5 is a cross plattform benchmark that heavily uses the systems memory. A fast memory will push the result a lot. The multi-core test involves all CPU cores and taks a big advantage of hyperthreading.
HiSilicon Kirin 970 HiSilicon Kirin 970
8C 8T @ 2.40 GHz
1455 (50%)
Qualcomm Snapdragon 7 Gen 1 Qualcomm Snapdragon 7 Gen 1
6C 6T @ 2.40 GHz
2932 (100%)

iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
HiSilicon Kirin 970 HiSilicon Kirin 970
ARM Mali-G72 MP12 @ 0.75 GHz
330 (100%)
Qualcomm Snapdragon 7 Gen 1 Qualcomm Snapdragon 7 Gen 1
Qualcomm Adreno 644 @ 0.44 GHz
0 (0%)

AnTuTu 9 Benchmark

The AnTuTu 9 benchmark is very well suited to measuring the performance of a smartphone. AnTuTu 9 is quite heavy on 3D graphics and can now also use the "Metal" graphics interface. In AnTuTu, memory and UX (user experience) are also tested by simulating browser and app usage. AnTuTu version 9 can compare any ARM CPU running on Android or iOS. Devices may not be directly comparable when benchmarked on different operating systems.

In the AnTuTu 9 benchmark, the single-core performance of a processor is only slightly weighted. The rating is made up of the multi-core performance of the processor, the speed of the working memory, and the performance of the internal graphics.
HiSilicon Kirin 970 HiSilicon Kirin 970
8C 8T @ 2.40 GHz
0 (0%)
Qualcomm Snapdragon 7 Gen 1 Qualcomm Snapdragon 7 Gen 1
6C 6T @ 2.40 GHz
536422 (100%)

Devices using this processor

HiSilicon Kirin 970 Qualcomm Snapdragon 7 Gen 1
Huawei Honor 10
Huawei Note 10
Huawei Play
Huawei Honor View 10
Huawei Mate 10 Pro
Huawei P20
Huawei Nova 3
Huawei Nova 4
Unknown

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