HiSilicon Kirin 910 | Intel Xeon D-2775TE | |
CPU comparisonIn this CPU comparison, we compare the HiSilicon Kirin 910 and the Intel Xeon D-2775TE and use benchmarks to check which processor is faster.
We compare the HiSilicon Kirin 910 4 core processor released in Q1/2014 with the Intel Xeon D-2775TE which has 16 CPU cores and was introduced in Q1/2022. |
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HiSilicon Kirin (29) | Family | Intel Xeon D (79) |
HiSilicon Kirin 910 (2) | CPU group | Intel Xeon D-2700 (16) |
1 | Generation | 4 |
Cortex-A9 | Architecture | Ice Lake |
Mobile | Segment | Desktop / Server |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 910 is a 4 core processor with a clock frequency of 1.60 GHz. The processor can compute 4 threads at the same time. The Intel Xeon D-2775TE clocks with 2.00 GHz (3.10 GHz), has 16 CPU cores and can calculate 32 threads in parallel. |
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HiSilicon Kirin 910 | Characteristic | Intel Xeon D-2775TE |
4 | Cores | 16 |
4 | Threads | 32 |
normal | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | No |
1.60 GHz | Frequency | 2.00 GHz |
-- | Turbo Frequency (1 Core) | 3.10 GHz |
-- | Turbo Frequency (All Cores) | 2.30 GHz |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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ARM Mali-450 MP4 | GPU | no iGPU |
0.53 GHz | GPU frequency | -- |
0.53 GHz | GPU (Turbo) | -- |
Utgard | GPU Generation | -- |
28nm | Technology | |
1 | Max. displays | |
4 | Compute units | -- |
64 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
0 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-450 MP4 | GPU | no iGPU |
No | Codec h265 / HEVC (8 bit) | No |
No | Codec h265 / HEVC (10 bit) | No |
No | Codec h264 | No |
No | Codec VP9 | No |
No | Codec VP8 | No |
No | Codec AV1 | No |
No | Codec AVC | No |
No | Codec VC-1 | No |
No | Codec JPEG | No |
Memory & PCIeUp to GB of memory in a maximum of 1 memory channels is supported by the HiSilicon Kirin 910, while the Intel Xeon D-2775TE supports a maximum of 1024 GB of memory with a maximum memory bandwidth of 93.8 GB/s enabled. |
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HiSilicon Kirin 910 | Characteristic | Intel Xeon D-2775TE |
LPDDR3 | Memory | DDR4-2933 |
Max. Memory | 1024 GB | |
1 (Single Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 93.8 GB/s |
No | ECC | Yes |
-- | L2 Cache | 25.00 MB |
-- | L3 Cache | -- |
-- | PCIe version | 4.0 |
-- | PCIe lanes | 32 |
-- | PCIe Bandwidth | 63.0 GB/s |
Thermal ManagementThe HiSilicon Kirin 910 has a TDP of --. The TDP of the Intel Xeon D-2775TE is 100 W. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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HiSilicon Kirin 910 | Characteristic | Intel Xeon D-2775TE |
-- | TDP (PL1 / PBP) | 100 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 910 has 0.00 MB cache and is manufactured in 28 nm. The cache of Intel Xeon D-2775TE is at 25.00 MB. The processor is manufactured in 10 nm. |
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HiSilicon Kirin 910 | Characteristic | Intel Xeon D-2775TE |
28 nm | Technology | 10 nm |
Chiplet | Chip design | Monolithic |
Armv7-A (32 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4.1, SSE4.2, AVX2, AVX-512 |
-- | Socket | BGA 2579 |
None | Virtualization | VT-x, VT-x EPT, VT-d |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Linux |
Q1/2014 | Release date | Q1/2022 |
-- | Release price | 1784 $ |
show more data | show more data | |
HiSilicon Kirin 910
ARM Mali-450 MP4 @ 0.53 GHz |
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Intel Xeon D-2775TE
@ 0.00 GHz |
Devices using this processor |
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HiSilicon Kirin 910 | Intel Xeon D-2775TE |
Unknown | Unknown |