HiSilicon Kirin 9000E | Qualcomm Snapdragon 768G | |
CPU comparisonHiSilicon Kirin 9000E or Qualcomm Snapdragon 768G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 9000E has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 9000E was released in Q4/2020. The Qualcomm Snapdragon 768G has 8 cores with 8 threads and clocks with a maximum frequency of 2.80 GHz. The CPU supports up to 12 GB of memory in 2 memory channels. The Qualcomm Snapdragon 768G was released in Q3/2020. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 9000 (2) | CPU group | Qualcomm Snapdragon 760 (3) |
9 | Generation | 3 |
Cortex-A77 / Cortex-A55 | Architecture | Kryo 475 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 9000E is 3.13 GHz while the Qualcomm Snapdragon 768G has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 768G is at 2.80 GHz. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 768G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.13 GHz 1x Cortex-A77 |
A-Core | 2.80 GHz 1x Kryo 475 Prime |
2.54 GHz 3x Cortex-A77 |
B-Core | 2.40 GHz 1x Kryo 475 Gold |
2.05 GHz 4x Cortex-A55 |
C-Core | 1.80 GHz 6x Kryo 475 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 768G |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 696 @ 5.5 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 9000E or Qualcomm Snapdragon 768G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G78 MP22 | GPU | Qualcomm Adreno 620 |
0.76 GHz | GPU frequency | 0.80 GHz |
-- | GPU (Turbo) | -- |
Vallhall 2 | GPU Generation | 6 |
5 nm | Technology | 7 nm |
1 | Max. displays | 2 |
22 | Compute units | -- |
352 | Shader | 192 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G78 MP22 | GPU | Qualcomm Adreno 620 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 9000E can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 768G supports up to 12 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 17.1 GB/s. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 768G |
LPDDR5-2750, LPDDR4X-2133 | Memory | LPDDR4-3733 |
Max. Memory | 12 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 17.1 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 9000E is --, while the Qualcomm Snapdragon 768G has a TDP of 5 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 768G |
-- | TDP (PL1 / PBP) | 5 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 9000E is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm Snapdragon 768G is manufactured in 7 nm and has a 2.00 MB cache. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 768G |
5 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2020 | Release date | Q3/2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 768G
8C 8T @ 2.80 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 768G
8C 8T @ 2.80 GHz |
HiSilicon Kirin 9000E
ARM Mali-G78 MP22 @ 0.76 GHz |
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Qualcomm Snapdragon 768G
Qualcomm Adreno 620 @ 0.80 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 768G
8C 8T @ 2.80 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 768G
8C 8T @ 2.80 GHz |
Devices using this processor |
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HiSilicon Kirin 9000E | Qualcomm Snapdragon 768G |
Unknown | Unknown |