HiSilicon Kirin 9000E | Qualcomm Snapdragon 4 Gen 2 | |
CPU comparisonHiSilicon Kirin 9000E or Qualcomm Snapdragon 4 Gen 2 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 9000E has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 9000E was released in Q4/2020. The Qualcomm Snapdragon 4 Gen 2 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. The CPU supports up to GB of memory in 2 memory channels. The Qualcomm Snapdragon 4 Gen 2 was released in Q2/2023. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 9000 (2) | CPU group | Qualcomm Snapdragon 4 Gen 2 (1) |
9 | Generation | 2 |
Cortex-A77 / Cortex-A55 | Architecture | Kryo Gold / Kryo Silver |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 9000E has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 9000E is 3.13 GHz while the Qualcomm Snapdragon 4 Gen 2 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 4 Gen 2 is at 2.20 GHz. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 4 Gen 2 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.13 GHz 1x Cortex-A77 |
A-Core | 2.20 GHz 2x Cortex-A78 |
2.54 GHz 3x Cortex-A77 |
B-Core | 2.00 GHz 6x Cortex-A55 |
2.05 GHz 4x Cortex-A55 |
C-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 4 Gen 2 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 9000E or Qualcomm Snapdragon 4 Gen 2 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G78 MP22 | GPU | Qualcomm Adreno 613 |
0.76 GHz | GPU frequency | 0.96 GHz |
-- | GPU (Turbo) | 0.96 GHz |
Vallhall 2 | GPU Generation | -- |
5 nm | Technology | |
1 | Max. displays | 2 |
22 | Compute units | -- |
352 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G78 MP22 | GPU | Qualcomm Adreno 613 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 9000E can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 4 Gen 2 supports up to GB of memory in 2 memory channels and achieves a memory bandwidth of up to 51.2 GB/s. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 4 Gen 2 |
LPDDR5-2750, LPDDR4X-2133 | Memory | LPDDR4X-4266, LPDDR5-6400 |
Max. Memory | ||
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 9000E is --, while the Qualcomm Snapdragon 4 Gen 2 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 4 Gen 2 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 9000E is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm Snapdragon 4 Gen 2 is manufactured in 4 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 9000E | Characteristic | Qualcomm Snapdragon 4 Gen 2 |
5 nm | Technology | 4 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android, Windows 10 (ARM) |
Q4/2020 | Release date | Q2/2023 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 4 Gen 2
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 4 Gen 2
8C 8T @ 2.20 GHz |
HiSilicon Kirin 9000E
ARM Mali-G78 MP22 @ 0.76 GHz |
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Qualcomm Snapdragon 4 Gen 2
Qualcomm Adreno 613 @ 0.96 GHz |
HiSilicon Kirin 9000E
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 4 Gen 2
8C 8T @ 2.20 GHz |
Devices using this processor |
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HiSilicon Kirin 9000E | Qualcomm Snapdragon 4 Gen 2 |
Unknown | Unknown |