HiSilicon Kirin 9000 | Qualcomm Snapdragon 7c | |
CPU comparisonHiSilicon Kirin 9000 or Qualcomm Snapdragon 7c - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 9000 has 8 cores with 8 threads and clocks with a maximum frequency of 3.13 GHz. Up to GB of memory is supported in 4 memory channels. The HiSilicon Kirin 9000 was released in Q4/2020. The Qualcomm Snapdragon 7c has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 7c was released in 2020. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 9000 (2) | CPU group | Qualcomm Snapdragon 7c (2) |
9 | Generation | 2 |
Cortex-A77 / Cortex-A55 | Architecture | Kryo 468 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | Qualcomm Snapdragon 7c Gen 2 |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 9000 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 9000 is 3.13 GHz while the Qualcomm Snapdragon 7c has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 7c is at 2.40 GHz. |
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HiSilicon Kirin 9000 | Characteristic | Qualcomm Snapdragon 7c |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.13 GHz 1x Cortex-A77 |
A-Core | 2.40 GHz 2x Kryo 468 Gold |
2.54 GHz 3x Cortex-A77 |
B-Core | 2.40 GHz 6x Kryo 468 Silver |
2.05 GHz 4x Cortex-A55 |
C-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 9000 | Characteristic | Qualcomm Snapdragon 7c |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 692 @ 5 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 9000 or Qualcomm Snapdragon 7c has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G78 MP24 | GPU | Qualcomm Adreno 618 |
0.76 GHz | GPU frequency | 0.70 GHz |
-- | GPU (Turbo) | -- |
Vallhall 2 | GPU Generation | 6 |
5 nm | Technology | 14 nm |
1 | Max. displays | 2 |
24 | Compute units | -- |
384 | Shader | 128 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G78 MP24 | GPU | Qualcomm Adreno 618 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 9000 can use up to GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 7c supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 17.1 GB/s. |
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HiSilicon Kirin 9000 | Characteristic | Qualcomm Snapdragon 7c |
LPDDR5-2750, LPDDR4X-2133 | Memory | LPDDR4X-4266 |
Max. Memory | 8 GB | |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 17.1 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 9000 is --, while the Qualcomm Snapdragon 7c has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 9000 | Characteristic | Qualcomm Snapdragon 7c |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 9000 is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm Snapdragon 7c is manufactured in 8 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 9000 | Characteristic | Qualcomm Snapdragon 7c |
5 nm | Technology | 8 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2020 | Release date | 2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 7c
8C 8T @ 2.40 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 7c
8C 8T @ 2.40 GHz |
HiSilicon Kirin 9000
ARM Mali-G78 MP24 @ 0.76 GHz |
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Qualcomm Snapdragon 7c
Qualcomm Adreno 618 @ 0.70 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 7c
8C 8T @ 2.40 GHz |
HiSilicon Kirin 9000
8C 8T @ 3.13 GHz |
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Qualcomm Snapdragon 7c
8C 8T @ 2.40 GHz |
Devices using this processor |
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HiSilicon Kirin 9000 | Qualcomm Snapdragon 7c |
Unknown | HP Chromebook x2 11 Acer Aspire 1 A114-61 |