HiSilicon Kirin 810 | Qualcomm Snapdragon 7c+ Gen 3 | |
CPU comparisonHiSilicon Kirin 810 or Qualcomm Snapdragon 7c+ Gen 3 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. The Qualcomm Snapdragon 7c+ Gen 3 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 7c+ Gen 3 was released in Q1/2022. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 810/820 (3) | CPU group | Qualcomm Snapdragon 7c Plus (1) |
6 | Generation | 3 |
Cortex-A76 / Cortex-A55 | Architecture | Cortex-A78 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 7c Gen 2 |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 810 is 2.20 GHz while the Qualcomm Snapdragon 7c+ Gen 3 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 7c+ Gen 3 is at 2.40 GHz. |
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HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.20 GHz 2x Cortex-A76 |
A-Core | 2.40 GHz 4x Cortex-A78 |
1.90 GHz 6x Cortex-A55 |
B-Core | 1.50 GHz 4x Cortex-A55 |
Integrated graphics (iGPU)The HiSilicon Kirin 810 or Qualcomm Snapdragon 7c+ Gen 3 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G52 MP6 | GPU | Qualcomm Adreno 642L |
0.85 GHz | GPU frequency | 0.70 GHz |
-- | GPU (Turbo) | -- |
Bifrost 2 | GPU Generation | 5 |
12 nm | Technology | 6 nm |
2 | Max. displays | 1 |
16 | Compute units | 4 |
288 | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G52 MP6 | GPU | Qualcomm Adreno 642L |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 810 can use up to 6 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 7c+ Gen 3 supports up to 16 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 51.2 GB/s. |
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HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
LPDDR4X-2133 | Memory | LPDDR5-6400, LPDDR4X-4266 |
6 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
1.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 810 is 5 W, while the Qualcomm Snapdragon 7c+ Gen 3 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
5 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 810 is manufactured in 7 nm and has 1.00 MB cache. The Qualcomm Snapdragon 7c+ Gen 3 is manufactured in 6 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 810 | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
7 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2019 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
Qualcomm Adreno 642L @ 0.70 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
Devices using this processor |
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HiSilicon Kirin 810 | Qualcomm Snapdragon 7c+ Gen 3 |
Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |
Unknown |