HiSilicon Kirin 810 | AMD Ryzen 3 4300G | |
CPU comparisonHiSilicon Kirin 810 or AMD Ryzen 3 4300G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 810 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 810 was released in Q2/2019. The AMD Ryzen 3 4300G has 4 cores with 8 threads and clocks with a maximum frequency of 4.00 GHz. The CPU supports up to 32 GB of memory in 2 memory channels. The AMD Ryzen 3 4300G was released in Q3/2020. |
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HiSilicon Kirin (29) | Family | AMD Ryzen 3 (33) |
HiSilicon Kirin 810/820 (3) | CPU group | AMD Ryzen 4000G (22) |
6 | Generation | 3 |
Cortex-A76 / Cortex-A55 | Architecture | Renoir (Zen 2) |
Mobile | Segment | Desktop / Server |
-- | Predecessor | -- |
-- | Successor | AMD Ryzen 3 5300G |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 810 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 810 is 2.20 GHz while the AMD Ryzen 3 4300G has 4 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the AMD Ryzen 3 4300G is at 3.80 GHz (4.00 GHz). |
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HiSilicon Kirin 810 | Characteristic | AMD Ryzen 3 4300G |
8 | Cores | 4 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | Yes |
2.20 GHz 2x Cortex-A76 |
A-Core | 3.80 GHz (4.00 GHz) 4x Zen 2 |
1.90 GHz 6x Cortex-A55 |
B-Core | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 810 or AMD Ryzen 3 4300G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G52 MP6 | GPU | AMD Radeon RX Vega 6 (Renoir) |
0.85 GHz | GPU frequency | 0.40 GHz |
-- | GPU (Turbo) | 1.70 GHz |
Bifrost 2 | GPU Generation | 9 |
12 nm | Technology | 7 nm |
2 | Max. displays | 3 |
16 | Compute units | 6 |
288 | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 2 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G52 MP6 | GPU | AMD Radeon RX Vega 6 (Renoir) |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 810 can use up to 6 GB of memory in 4 memory channels. The maximum memory bandwidth is --. The AMD Ryzen 3 4300G supports up to 32 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 51.2 GB/s. |
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HiSilicon Kirin 810 | Characteristic | AMD Ryzen 3 4300G |
LPDDR4X-2133 | Memory | DDR4-3200 |
6 GB | Max. Memory | 32 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | Yes |
-- | L2 Cache | 2.00 MB |
1.00 MB | L3 Cache | 4.00 MB |
-- | PCIe version | 3.0 |
-- | PCIe lanes | 12 |
-- | PCIe Bandwidth | 11.8 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 810 is 5 W, while the AMD Ryzen 3 4300G has a TDP of 65 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 810 | Characteristic | AMD Ryzen 3 4300G |
5 W | TDP (PL1 / PBP) | 65 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | 45 W |
-- | Tjunction max. | 100 °C |
Technical detailsThe HiSilicon Kirin 810 is manufactured in 7 nm and has 1.00 MB cache. The AMD Ryzen 3 4300G is manufactured in 7 nm and has a 6.00 MB cache. |
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HiSilicon Kirin 810 | Characteristic | AMD Ryzen 3 4300G |
7 nm | Technology | 7 nm |
Chiplet | Chip design | Monolithic |
Armv8-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 |
-- | Socket | AM4 (PGA 1331) |
None | Virtualization | AMD-V, SVM |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Windows 11, Linux |
Q2/2019 | Release date | Q3/2020 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
HiSilicon Kirin 810
ARM Mali-G52 MP6 @ 0.85 GHz |
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AMD Ryzen 3 4300G
AMD Radeon RX Vega 6 (Renoir) @ 1.70 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 3.80 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 3.80 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
HiSilicon Kirin 810
8C 8T @ 2.20 GHz |
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AMD Ryzen 3 4300G
4C 8T @ 4.00 GHz |
Devices using this processor |
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HiSilicon Kirin 810 | AMD Ryzen 3 4300G |
Huawei Honor 9X Pro Huawei Honor Play 4T Pro Huawei MatePad 10.4 Huawei Nova 5i Pro Huawei P40 Lite |
Unknown |