HiSilicon Kirin 710A | MediaTek Dimensity 900 | |
CPU comparisonHiSilicon Kirin 710A or MediaTek Dimensity 900 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 710A has 8 cores with 8 threads and clocks with a maximum frequency of 2.00 GHz. Up to 6 GB of memory is supported in 2 memory channels. The HiSilicon Kirin 710A was released in Q2/2020. The MediaTek Dimensity 900 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The MediaTek Dimensity 900 was released in Q2/2021. |
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HiSilicon Kirin (29) | Family | Mediatek Dimensity (36) |
HiSilicon Kirin 710A (1) | CPU group | MediaTek Dimensity 900 (3) |
5 | Generation | 2 |
Cortex-A73 / Cortex-A53 | Architecture | Cortex-A78 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 710A has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 710A is 2.00 GHz while the MediaTek Dimensity 900 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the MediaTek Dimensity 900 is at 2.40 GHz. |
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HiSilicon Kirin 710A | Characteristic | MediaTek Dimensity 900 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.00 GHz 4x Cortex-A73 |
A-Core | 2.40 GHz 2x Cortex-A78 |
1.60 GHz 4x Cortex-A53 |
B-Core | 2.00 GHz 6x Cortex-A55 |
Internal GraphicsThe HiSilicon Kirin 710A or MediaTek Dimensity 900 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G51 MP4 | GPU | ARM Mali-G68 MP4 |
0.65 GHz | GPU frequency | 0.85 GHz |
1.00 GHz | GPU (Turbo) | -- |
Bifrost 1 | GPU Generation | Vallhall 2 |
12 nm | Technology | 6 nm |
2 | Max. displays | 1 |
8 | Compute units | 4 |
128 | Shader | 64 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
11 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G51 MP4 | GPU | ARM Mali-G68 MP4 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
No | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 710A can use up to 6 GB of memory in 2 memory channels. The maximum memory bandwidth is --. The MediaTek Dimensity 900 supports up to 16 GB of memory in 4 memory channels and achieves a memory bandwidth of up to 44.0 GB/s. |
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HiSilicon Kirin 710A | Characteristic | MediaTek Dimensity 900 |
LPDDR4, LPDDR3 | Memory | LPDDR5-5500, LPDDR4X-4266 |
6 GB | Max. Memory | 16 GB |
2 (Dual Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 44.0 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
1.00 MB | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 710A is 5 W, while the MediaTek Dimensity 900 has a TDP of 10 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 710A | Characteristic | MediaTek Dimensity 900 |
5 W | TDP (PL1 / PBP) | 10 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 710A is manufactured in 14 nm and has 1.00 MB cache. The MediaTek Dimensity 900 is manufactured in 6 nm and has a 2.00 MB cache. |
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HiSilicon Kirin 710A | Characteristic | MediaTek Dimensity 900 |
14 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q2/2020 | Release date | Q2/2021 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
HiSilicon Kirin 710A
ARM Mali-G51 MP4 @ 1.00 GHz |
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MediaTek Dimensity 900
ARM Mali-G68 MP4 @ 0.85 GHz |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
HiSilicon Kirin 710A
8C 8T @ 2.00 GHz |
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MediaTek Dimensity 900
8C 8T @ 2.40 GHz |
Devices using this processor |
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HiSilicon Kirin 710A | MediaTek Dimensity 900 |
Honor 10X Lite | Unknown |