HiSilicon Kirin 710 | Qualcomm Snapdragon 600 | |
CPU comparisonHiSilicon Kirin 710 or Qualcomm Snapdragon 600 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 710 has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 6 GB of memory is supported in 2 memory channels. The HiSilicon Kirin 710 was released in Q3/2018. The Qualcomm Snapdragon 600 has 4 cores with 4 threads and clocks with a maximum frequency of 1.70 GHz. The CPU supports up to 8 GB of memory in 2 memory channels. The Qualcomm Snapdragon 600 was released in Q1/2013. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 710 (1) | CPU group | Qualcomm Snapdragon 600 (1) |
5 | Generation | 2 |
Cortex-A73 / Cortex-A53 | Architecture | Krait |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 710 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the HiSilicon Kirin 710 is 2.20 GHz while the Qualcomm Snapdragon 600 has 4 CPU cores and 4 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 600 is at 1.70 GHz. |
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HiSilicon Kirin 710 | Characteristic | Qualcomm Snapdragon 600 |
8 | Cores | 4 |
8 | Threads | 4 |
hybrid (big.LITTLE) | Core architecture | normal |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.20 GHz 4x Cortex-A73 |
A-Core | 1.70 GHz 4x Krait |
1.70 GHz 4x Cortex-A53 |
B-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 710 | Characteristic | Qualcomm Snapdragon 600 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon QDSP6 |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The HiSilicon Kirin 710 or Qualcomm Snapdragon 600 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G51 MP4 | GPU | Qualcomm Adreno 320 |
0.65 GHz | GPU frequency | 0.55 GHz |
1.00 GHz | GPU (Turbo) | 0.55 GHz |
Bifrost 1 | GPU Generation | 3 |
12 nm | Technology | 28 nm |
2 | Max. displays | 0 |
8 | Compute units | -- |
128 | Shader | 16 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
11 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G51 MP4 | GPU | Qualcomm Adreno 320 |
Decode / Encode | Codec h265 / HEVC (8 bit) | No |
No | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe HiSilicon Kirin 710 can use up to 6 GB of memory in 2 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 600 supports up to 8 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 12.8 GB/s. |
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HiSilicon Kirin 710 | Characteristic | Qualcomm Snapdragon 600 |
LPDDR4, LPDDR3 | Memory | LPDDR3-1600 |
6 GB | Max. Memory | 8 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 12.8 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
1.00 MB | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the HiSilicon Kirin 710 is 5 W, while the Qualcomm Snapdragon 600 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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HiSilicon Kirin 710 | Characteristic | Qualcomm Snapdragon 600 |
5 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 710 is manufactured in 12 nm and has 1.00 MB cache. The Qualcomm Snapdragon 600 is manufactured in 28 nm and has a 0.00 MB cache. |
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HiSilicon Kirin 710 | Characteristic | Qualcomm Snapdragon 600 |
12 nm | Technology | 28 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv7-A (32 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2018 | Release date | Q1/2013 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 600
4C 4T @ 1.70 GHz |
HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 600
4C 4T @ 1.70 GHz |
HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 600
4C 4T @ 1.70 GHz |
HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 600
4C 4T @ 1.70 GHz |
HiSilicon Kirin 710
ARM Mali-G51 MP4 @ 1.00 GHz |
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Qualcomm Snapdragon 600
Qualcomm Adreno 320 @ 0.55 GHz |
HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 600
4C 4T @ 1.70 GHz |
HiSilicon Kirin 710
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 600
4C 4T @ 1.70 GHz |
Devices using this processor |
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HiSilicon Kirin 710 | Qualcomm Snapdragon 600 |
Huawei Honor 8X Huawei P30 lite |
Unknown |