UNISOC T740 vs Qualcomm Snapdragon 212
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CPU comparison with benchmarks
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| UNISOC T740 | Qualcomm Snapdragon 212 | |
CPU comparisonUNISOC T740 or Qualcomm Snapdragon 212 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The UNISOC T740 has 8 cores with 8 threads and clocks with a maximum frequency of 1.80 GHz. Up to GB of memory is supported in 0 memory channels. The UNISOC T740 was released in Q1/2020. The Qualcomm Snapdragon 212 has 4 cores with 4 threads and clocks with a maximum frequency of 1.30 GHz. The CPU supports up to 4 GB of memory in 1 memory channels. The Qualcomm Snapdragon 212 was released in 2015. |
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| UNISOC 5G (3) | Family | Qualcomm Snapdragon (104) |
| UNISOC 5G 12nm (1) | CPU group | Qualcomm Snapdragon 205-212 (4) |
| 0 | Generation | 2 |
| -- | Architecture | Cortex-A7 |
| Mobile | Segment | Mobile |
| -- | Predecessor | -- |
| -- | Successor | -- |
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CPU Cores and Base FrequencyThe UNISOC T740 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the UNISOC T740 is 1.80 GHz while the Qualcomm Snapdragon 212 has 4 CPU cores and 4 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 212 is at 1.30 GHz. |
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| UNISOC T740 | Characteristic | Qualcomm Snapdragon 212 |
| 8 | Cores | 4 |
| 8 | Threads | 4 |
| hybrid (big.LITTLE) | Core architecture | normal |
| No | Hyperthreading | No |
| No | Overclocking ? | No |
| 1.80 GHz 4x Cortex-A75 |
A-Core | 1.30 GHz 4x Cortex-A7 |
| 1.80 GHz 4x Cortex-A55 |
B-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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| UNISOC T740 | Characteristic | Qualcomm Snapdragon 212 |
| -- | AI hardware | Qualcomm AI engine |
| -- | AI specifications | Hexagon QDSP6 |
| -- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The UNISOC T740 or Qualcomm Snapdragon 212 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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| PowerVR GM 9446 | GPU | Qualcomm Adreno 304 |
| 0.80 GHz | GPU frequency | 0.40 GHz |
| -- | GPU (Turbo) | 0.40 GHz |
| 1 | GPU Generation | 3 |
| 12 | Technology | 28 nm |
| 0 | Max. displays | 0 |
| 3 | Compute units | -- |
| 12 | Shader | 24 |
| No | Hardware Raytracing | No |
| No | Frame Generation | No |
| 2 GB | Max. GPU Memory | -- |
| -- | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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| PowerVR GM 9446 | GPU | Qualcomm Adreno 304 |
| Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
| Decode | Codec h265 / HEVC (10 bit) | No |
| Decode / Encode | Codec h264 | Decode / Encode |
| No | Codec VP9 | No |
| No | Codec VP8 | No |
| No | Codec AV1 | No |
| No | Codec AVC | No |
| No | Codec VC-1 | Decode |
| Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe UNISOC T740 can use up to GB of memory in 0 memory channels. The maximum memory bandwidth is --. The Qualcomm Snapdragon 212 supports up to 4 GB of memory in 1 memory channels and achieves a memory bandwidth of up to 4.3 GB/s. |
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| UNISOC T740 | Characteristic | Qualcomm Snapdragon 212 |
| LPDDR4X-1866, LPDDR4-1866 | Memory | LPDDR3-1066, LPDDR2-1066 |
| Max. Memory | 4 GB | |
| 0 | Memory channels | 1 (Single Channel) |
| -- | Max. Bandwidth | 4.3 GB/s |
| No | ECC | No |
| -- | L2 Cache | -- |
| -- | L3 Cache | -- |
| -- | PCIe version | -- |
| -- | PCIe lanes | -- |
| -- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the UNISOC T740 is --, while the Qualcomm Snapdragon 212 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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| UNISOC T740 | Characteristic | Qualcomm Snapdragon 212 |
| -- | TDP (PL1 / PBP) | -- |
| -- | TDP (PL2) | -- |
| -- | TDP up | -- |
| -- | TDP down | -- |
| -- | Tjunction max. | -- |
Technical detailsThe UNISOC T740 is manufactured in 12 nm and has 0.00 MB cache. The Qualcomm Snapdragon 212 is manufactured in 28 nm and has a 0.00 MB cache. |
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| UNISOC T740 | Characteristic | Qualcomm Snapdragon 212 |
| 12 nm | Technology | 28 nm |
| Unknown | Chip design | Chiplet |
| Armv8-A (64 bit) | Instruction set (ISA) | Armv7-A (32 bit) |
| -- | ISA extensions | -- |
| -- | Socket | -- |
| None | Virtualization | None |
| No | AES-NI | No |
| Android | Operating systems | Android |
| Q1/2020 | Release date | 2015 |
| -- | Release price | -- |
| show more data | show more data | |
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iGPU - FP32 Performance (Single-precision GFLOPS)
The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
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UNISOC T740
PowerVR GM 9446 @ 0.80 GHz |
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Qualcomm Snapdragon 212
Qualcomm Adreno 304 @ 0.40 GHz |
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Devices using this processor |
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| UNISOC T740 | Qualcomm Snapdragon 212 |
| Unknown | Unknown |
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