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UNISOC T700 | Qualcomm Snapdragon 425 | |
CPU comparisonIn this CPU comparison, we compare the UNISOC T700 and the Qualcomm Snapdragon 425 and use benchmarks to check which processor is faster.
We compare the UNISOC T700 8 core processor released in Q1/2021 with the Qualcomm Snapdragon 425 which has 4 CPU cores and was introduced in Q3/2016. |
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UNISOC 4G (10) | Family | Qualcomm Snapdragon (104) |
UNISOC 4G 12nm (8) | CPU group | Qualcomm Snapdragon 425/427 (2) |
0 | Generation | 3 |
-- | Architecture | Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe UNISOC T700 is a 8 core processor with a clock frequency of 1.80 GHz. The processor can compute 8 threads at the same time. The Qualcomm Snapdragon 425 clocks with 1.40 GHz, has 4 CPU cores and can calculate 4 threads in parallel. |
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UNISOC T700 | Characteristic | Qualcomm Snapdragon 425 |
8 | Cores | 4 |
8 | Threads | 4 |
hybrid (big.LITTLE) | Core architecture | normal |
No | Hyperthreading | No |
No | Overclocking ? | No |
1.80 GHz 2x Cortex-A75 |
A-Core | 1.40 GHz 4x Cortex-A53 |
1.80 GHz 6x Cortex-A55 |
B-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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UNISOC T700 | Characteristic | Qualcomm Snapdragon 425 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 536 |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)Graphics (iGPU) integrated into the processor not only enable image output without having to rely on a dedicated graphics solution, but can also efficiently accelerate video playback. |
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ARM Mali-G52 MP2 | GPU | Qualcomm Adreno 308 |
0.85 GHz | GPU frequency | 0.50 GHz |
-- | GPU (Turbo) | 0.50 GHz |
Bifrost 2 | GPU Generation | 3 |
16 nm | Technology | 28 nm |
2 | Max. displays | 0 |
2 | Compute units | -- |
32 | Shader | 24 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G52 MP2 | GPU | Qualcomm Adreno 308 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
No | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeUp to GB of memory in a maximum of 0 memory channels is supported by the UNISOC T700, while the Qualcomm Snapdragon 425 supports a maximum of 4 GB of memory with a maximum memory bandwidth of 10.7 GB/s enabled. |
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UNISOC T700 | Characteristic | Qualcomm Snapdragon 425 |
LPDDR4X-1866, LPDDR4-1866, LPDDR3-933 | Memory | LPDDR3-1333 |
Max. Memory | 4 GB | |
0 | Memory channels | 2 (Dual Channel) |
-- | Max. Bandwidth | 10.7 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe UNISOC T700 has a TDP of --. The TDP of the Qualcomm Snapdragon 425 is --. System integrators use the TDP of the processor as a guide when dimensioning the cooling solution. |
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UNISOC T700 | Characteristic | Qualcomm Snapdragon 425 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe UNISOC T700 has 0.00 MB cache and is manufactured in 12 nm. The cache of Qualcomm Snapdragon 425 is at 0.00 MB. The processor is manufactured in 28 nm. |
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UNISOC T700 | Characteristic | Qualcomm Snapdragon 425 |
12 nm | Technology | 28 nm |
Unknown | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2021 | Release date | Q3/2016 |
-- | Release price | -- |
show more data | show more data | |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
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UNISOC T700
ARM Mali-G52 MP2 @ 0.85 GHz |
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Qualcomm Snapdragon 425
Qualcomm Adreno 308 @ 0.50 GHz |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
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UNISOC T700
8C 8T @ 1.80 GHz |
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Qualcomm Snapdragon 425
4C 4T @ 1.40 GHz |
Devices using this processor |
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UNISOC T700 | Qualcomm Snapdragon 425 |
Unknown | Unknown |