Samsung Exynos 2400 | HiSilicon Kirin 990 5G | |
CPU comparisonSamsung Exynos 2400 or HiSilicon Kirin 990 5G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Samsung Exynos 2400 has 10 cores with 10 threads and clocks with a maximum frequency of 3.20 GHz. Up to 12 GB of memory is supported in 4 memory channels. The Samsung Exynos 2400 was released in Q4/2023. The HiSilicon Kirin 990 5G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 990 5G was released in Q3/2019. |
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Samsung Exynos (47) | Family | HiSilicon Kirin (29) |
Samsung Exynos 2400 (1) | CPU group | HiSilicon Kirin 990 (3) |
7 | Generation | 8 |
Cortex-X4/-A720/-A520 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Samsung Exynos 2400 is a 10 core processor with a clock frequency of 3.20 GHz. The HiSilicon Kirin 990 5G has 8 CPU cores with a clock frequency of 2.86 GHz. |
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Samsung Exynos 2400 | Characteristic | HiSilicon Kirin 990 5G |
10 | Cores | 8 |
10 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
3.20 GHz 1x Cortex-X4 |
A-Core | 2.86 GHz 2x Cortex-A76 |
2.90 GHz 5x Cortex-A720 |
B-Core | 2.36 GHz 2x Cortex-A76 |
1.95 GHz 4x Cortex-A520 |
C-Core | 1.95 GHz 4x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Samsung Exynos 2400 | Characteristic | HiSilicon Kirin 990 5G |
Samsung AI engine | AI hardware | HUAWEI HiAI 2.0 |
Samsung AI Accelerator @ 44 TOPS | AI specifications | Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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Samsung Xclipse 940 | GPU | ARM Mali-G76 MP16 |
1.40 GHz | GPU frequency | 0.60 GHz |
-- | GPU (Turbo) | -- |
-- | GPU Generation | Bifrost 3 |
4 nm | Technology | 7 nm |
0 | Max. displays | 2 |
12 | Compute units | 16 |
384 | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Samsung Xclipse 940 | GPU | ARM Mali-G76 MP16 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
No | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
No | Codec AVC | Decode / Encode |
No | Codec VC-1 | Decode / Encode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe Samsung Exynos 2400 supports a maximum of 12 GB of memory in 4 memory channels. The HiSilicon Kirin 990 5G can connect up to 8 GB of memory in 4 memory channels. |
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Samsung Exynos 2400 | Characteristic | HiSilicon Kirin 990 5G |
LPDDR5X-8533 | Memory | LPDDR4X-4266 |
12 GB | Max. Memory | 8 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
68.3 GB/s | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The Samsung Exynos 2400 has a TDP of 12 W, that of the HiSilicon Kirin 990 5G is 6 W. |
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Samsung Exynos 2400 | Characteristic | HiSilicon Kirin 990 5G |
12 W | TDP (PL1 / PBP) | 6 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Samsung Exynos 2400 has a 0.00 MB cache, while the HiSilicon Kirin 990 5G cache has a total of 2.00 MB. |
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Samsung Exynos 2400 | Characteristic | HiSilicon Kirin 990 5G |
4 nm | Technology | 7 nm |
Unknown | Chip design | Chiplet |
Armv9-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q4/2023 | Release date | Q3/2019 |
-- | Release price | -- |
show more data | show more data | |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
Samsung Xclipse 940 @ 1.40 GHz |
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HiSilicon Kirin 990 5G
ARM Mali-G76 MP16 @ 0.60 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Samsung Exynos 2400
10C 10T @ 3.20 GHz |
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HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
Devices using this processor |
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Samsung Exynos 2400 | HiSilicon Kirin 990 5G |
Samsung Galaxy S24 Samsung Galaxy S24 Plus |
Unknown |