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Samsung Exynos 1330 | HiSilicon Kirin 990 4G | |
CPU comparisonSamsung Exynos 1330 or HiSilicon Kirin 990 4G - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Samsung Exynos 1330 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. Up to GB of memory is supported in 0 memory channels. The Samsung Exynos 1330 was released in Q1/2023. The HiSilicon Kirin 990 4G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. The CPU supports up to 8 GB of memory in 4 memory channels. The HiSilicon Kirin 990 4G was released in Q3/2019. |
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Samsung Exynos (47) | Family | HiSilicon Kirin (29) |
Samsung Exynos 13xx (2) | CPU group | HiSilicon Kirin 990 (3) |
7 | Generation | 8 |
Cortex-A78/-A55 | Architecture | Cortex-A76 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Samsung Exynos 1330 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Samsung Exynos 1330 is 2.40 GHz while the HiSilicon Kirin 990 4G has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the HiSilicon Kirin 990 4G is at 2.86 GHz. |
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Samsung Exynos 1330 | Characteristic | HiSilicon Kirin 990 4G |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.40 GHz 2x Cortex-A78 |
A-Core | 2.86 GHz 2x Cortex-A76 |
2.00 GHz 6x Cortex-A55 |
B-Core | 2.09 GHz 2x Cortex-A76 |
-- | C-Core | 1.86 GHz 4x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Samsung Exynos 1330 | Characteristic | HiSilicon Kirin 990 4G |
-- | AI hardware | HUAWEI HiAI 2.0 |
-- | AI specifications | Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The Samsung Exynos 1330 or HiSilicon Kirin 990 4G has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G68 MP2 | GPU | ARM Mali-G76 MP16 |
GPU frequency | 0.60 GHz | |
-- | GPU (Turbo) | -- |
Vallhall 2 | GPU Generation | Bifrost 3 |
6 nm | Technology | 7 nm |
1 | Max. displays | 2 |
2 | Compute units | 16 |
32 | Shader | 256 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G68 MP2 | GPU | ARM Mali-G76 MP16 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode / Encode |
Decode / Encode | Codec VC-1 | Decode / Encode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe Samsung Exynos 1330 can use up to GB of memory in 0 memory channels. The maximum memory bandwidth is --. The HiSilicon Kirin 990 4G supports up to 8 GB of memory in 4 memory channels and achieves a memory bandwidth of up to --. |
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Samsung Exynos 1330 | Characteristic | HiSilicon Kirin 990 4G |
LPDDR5, LPDDR4X | Memory | LPDDR4X-2133 |
Max. Memory | 8 GB | |
0 | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | -- |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Samsung Exynos 1330 is --, while the HiSilicon Kirin 990 4G has a TDP of 6 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Samsung Exynos 1330 | Characteristic | HiSilicon Kirin 990 4G |
-- | TDP (PL1 / PBP) | 6 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Samsung Exynos 1330 is manufactured in 5 nm and has 0.00 MB cache. The HiSilicon Kirin 990 4G is manufactured in 7 nm and has a 2.00 MB cache. |
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Samsung Exynos 1330 | Characteristic | HiSilicon Kirin 990 4G |
5 nm | Technology | 7 nm |
Unknown | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android, Windows ARM | Operating systems | Android |
Q1/2023 | Release date | Q3/2019 |
-- | Release price | -- |
show more data | show more data | |
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Samsung Exynos 1330
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Samsung Exynos 1330
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Samsung Exynos 1330
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Samsung Exynos 1330
8C 8T @ 2.40 GHz |
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HiSilicon Kirin 990 4G
8C 8T @ 2.86 GHz |
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Samsung Exynos 1330
ARM Mali-G68 MP2 @ 0.00 GHz |
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HiSilicon Kirin 990 4G
ARM Mali-G76 MP16 @ 0.60 GHz |
Devices using this processor |
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Samsung Exynos 1330 | HiSilicon Kirin 990 4G |
Unknown | Huawei Mate 30 Pro |