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Qualcomm Snapdragon 888+ vs MediaTek Dimensity 8100
Last updated:
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 6 Single-Core
Single-core performance
Qualcomm Snapdragon 888+
100 %
8C / 8T · 3.00 GHz
8C / 8T · 2.85 GHz
Geekbench 6 Multi-Core
Multi-core performance
8C / 8T · 3.00 GHz
MediaTek Dimensity 8100
100 %
8C / 8T · 2.85 GHz
Geekbench 5, 64bit Single-Core
Single-core performance
Qualcomm Snapdragon 888+
100 %
8C / 8T · 3.00 GHz
8C / 8T · 2.85 GHz
Geekbench 5, 64bit Multi-Core
Multi-core performance
8C / 8T · 3.00 GHz
MediaTek Dimensity 8100
100 %
8C / 8T · 2.85 GHz
AnTuTu 9 Benchmark
Multi-core performance
Qualcomm Snapdragon 888+
100 %
8C / 8T · 3.00 GHz
8C / 8T · 2.85 GHz
More benchmarks
Specifications
At a glance
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| Family | Qualcomm Snapdragon (105) | Mediatek Dimensity (38) |
| CPU group | Qualcomm Snapdragon 888 (2) | MediaTek Dimensity 8000 (4) |
| Architecture | Kryo 680 | Cortex-A78 / Cortex-A55 |
| Technology | 5 nm | 5 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Socket | ||
| Predecessor | ||
| Successor |
CPU Cores and Base Frequency
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Core architecture | hybrid (Prime / big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 1x Kryo 680 Prime 3.00 GHz |
4x Cortex-A78 2.85 GHz |
| Core Cluster 2: | 3x Kryo 680 Gold 1.80 GHz |
4x Cortex-A55 2.00 GHz |
| Core Cluster 3: | 4x Kryo 680 Silver 0 GHz |
|
| L2-Cache | 4.00 MB | |
| L3-Cache | 4.00 MB | |
| Overclocking | ✗ | ✗ |
Integrated graphics (iGPU)
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| GPU name | Qualcomm Adreno 660 AV1 | ARM Mali-G610 MP6 |
| GPU frequency | 0.84 GHz | |
| CUs / Shader | / | 6 / |
| Raytracing | ✗ | ✗ |
| Max. displays | 0 | 1 |
| Max. GPU Memory | ||
| Technology | 5 nm | 4 nm |
| Release date | Q1/2021 | Q2/2021 |
NPU AI performance
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| AI hardware | Qualcomm AI engine | |
| AI specifications | Hexagon 780 @ 32 TOPS | |
| NPU + CPU + iGPU |
Memory & PCIe
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| Memory | LPDDR5-6400 (51.2 GB/s) | LPDDR5-6400 (51.2 GB/s) |
| Max. Memory | 16 GB | 16 GB |
| Memory channels | 4 | 4 |
| ECC | No | No |
| PCIe | ||
| PCIe Bandwidth |
Thermal Management
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| TDP | ||
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
Technical details
|
Wischen
|
Qualcomm Snapdragon 888+ | MediaTek Dimensity 8100 |
|---|---|---|
| Chip design | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Operating systems | Android | Android |
| Instruction set | Armv8-A (64 bit) | Armv8-A (64 bit) |
| ISA extensions | ||
| Release date | Q3/2021 | Q1/2022 |
| Release price | ||
| Documents | Technical data sheet | Technical data sheet |
User Reviews
Your rating
Here you can rate one or both of the processors. The average rating of Qualcomm Snapdragon 888+ is 4.0 stars (23 ratings), while MediaTek Dimensity 8100 has received 4.1 stars (28 ratings).
Click on the stars to rate one or both processors.
Most popular CPUs in both categories
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MediaTek Dimensity 8300
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Qualcomm Snapdragon 888+
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