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Qualcomm Snapdragon 855 vs MediaTek Dimensity 8300
Last updated:
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 6 Single-Core
Single-core performance
8C / 8T · 2.84 GHz
MediaTek Dimensity 8300
100 %
8C / 8T · 3.35 GHz
Geekbench 6 Multi-Core
Multi-core performance
8C / 8T · 2.84 GHz
MediaTek Dimensity 8300
100 %
8C / 8T · 3.35 GHz
More benchmarks
Specifications
At a glance
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| Family | Qualcomm Snapdragon (105) | Mediatek Dimensity (38) |
| CPU group | Qualcomm Snapdragon 855/860 (3) | MediaTek Dimensity 8300 (1) |
| Architecture | Kryo 485 | Cortex-A715 / -A510 |
| Technology | 7 nm | 4 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Socket | ||
| Predecessor | Qualcomm Snapdragon 845 | |
| Successor |
CPU Cores and Base Frequency
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Core architecture | hybrid (Prime / big.LITTLE) | hybrid (Prime / big.LITTLE) |
| Core Cluster 1: | 1x Kryo 485 Prime 2.84 GHz |
1x Cortex-A715 3.35 GHz |
| Core Cluster 2: | 3x Kryo 485 Gold 2.42 GHz |
3x Cortex-A715 3.20 GHz |
| Core Cluster 3: | 4x Kryo 485 Silver 1.80 GHz |
4x Cortex-A510 2.20 GHz |
| L2-Cache | 1.75 MB | |
| L3-Cache | 2.00 MB | 4.00 MB |
| Overclocking | ✗ | ✗ |
Integrated graphics (iGPU)
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| GPU name | Qualcomm Adreno 640 | ARM Mali-G615 MP6 |
| GPU frequency | 0.25 - 0.59 GHz | 1.40 - 1.40 GHz |
| CUs / Shader | 4 / 384 | 6 / |
| Raytracing | ✗ | ✗ |
| Max. displays | 1 | 1 |
| Max. GPU Memory | 4 GB | |
| Technology | 7 nm | 4 nm |
| Release date | Q1/2019 | Q4/2023 |
NPU AI performance
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| AI hardware | Qualcomm AI engine | Mediatek APU |
| AI specifications | Hexagon 690 @ 7 TOPS | APU 780 |
| NPU + CPU + iGPU |
Memory & PCIe
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| Memory | LPDDR4X-4266 (34.1 GB/s) | LPDDR5X-8533 (68.2 GB/s) |
| Max. Memory | 16 GB | |
| Memory channels | 4 | 4 |
| ECC | No | No |
| PCIe | ||
| PCIe Bandwidth |
Thermal Management
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| TDP | ||
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
Technical details
|
Wischen
|
Qualcomm Snapdragon 855 | MediaTek Dimensity 8300 |
|---|---|---|
| Chip design | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Operating systems | Android | Android |
| Instruction set | Armv8-A (64 bit) | Armv9-A (64 bit) |
| ISA extensions | ||
| Release date | Q4/2018 | Q4/2023 |
| Release price | ||
| Documents | Technical data sheet | Technical data sheet |
User Reviews
Your rating
Here you can rate one or both of the processors. The average rating of Qualcomm Snapdragon 855 is 4.3 stars (62 ratings), while MediaTek Dimensity 8300 has received 4.6 stars (141 ratings).
Click on the stars to rate one or both processors.
Most popular CPUs in both categories
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MediaTek Dimensity 8300
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Qualcomm Snapdragon 855
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