Qualcomm Snapdragon 778G+ | Intel Xeon D-1602 | |
CPU comparisonQualcomm Snapdragon 778G+ or Intel Xeon D-1602 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Qualcomm Snapdragon 778G+ has 8 cores with 8 threads and clocks with a maximum frequency of 2.50 GHz. Up to 16 GB of memory is supported in 2 memory channels. The Qualcomm Snapdragon 778G+ was released in Q4/2021. The Intel Xeon D-1602 has 2 cores with 4 threads and clocks with a maximum frequency of 3.20 GHz. The CPU supports up to 128 GB of memory in 2 memory channels. The Intel Xeon D-1602 was released in Q2/2019. |
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Qualcomm Snapdragon (104) | Family | Intel Xeon D (79) |
Qualcomm Snapdragon 778 (2) | CPU group | Intel Xeon D-1600 (8) |
4 | Generation | 3 |
Kryo 670 | Architecture | Hewitt Lake |
Mobile | Segment | Desktop / Server |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe Qualcomm Snapdragon 778G+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the Qualcomm Snapdragon 778G+ is 2.50 GHz while the Intel Xeon D-1602 has 2 CPU cores and 4 threads can calculate simultaneously. The clock frequency of the Intel Xeon D-1602 is at 2.50 GHz (3.20 GHz). |
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Qualcomm Snapdragon 778G+ | Characteristic | Intel Xeon D-1602 |
8 | Cores | 2 |
8 | Threads | 4 |
hybrid (Prime / big.LITTLE) | Core architecture | normal |
No | Hyperthreading | Yes |
No | Overclocking ? | No |
2.50 GHz 1x Kryo 670 Prime |
A-Core | 2.50 GHz (3.20 GHz) |
2.20 GHz 3x Kryo 670 Gold |
B-Core | -- |
1.90 GHz 4x Kryo 670 Silver |
C-Core | -- |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Qualcomm Snapdragon 778G+ | Characteristic | Intel Xeon D-1602 |
Qualcomm AI engine | AI hardware | -- |
Hexagon 770 @ 12 TOPS | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The Qualcomm Snapdragon 778G+ or Intel Xeon D-1602 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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Qualcomm Adreno 642L | GPU | no iGPU |
GPU frequency | -- | |
-- | GPU (Turbo) | -- |
5 | GPU Generation | -- |
6 nm | Technology | |
1 | Max. displays | |
4 | Compute units | -- |
384 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12.0 | DirectX Version | -- |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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Qualcomm Adreno 642L | GPU | no iGPU |
Decode | Codec h265 / HEVC (8 bit) | No |
Decode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | No |
Decode | Codec VP9 | No |
Decode | Codec VP8 | No |
No | Codec AV1 | No |
Decode | Codec AVC | No |
Decode | Codec VC-1 | No |
Decode / Encode | Codec JPEG | No |
Memory & PCIeThe Qualcomm Snapdragon 778G+ can use up to 16 GB of memory in 2 memory channels. The maximum memory bandwidth is 25.6 GB/s. The Intel Xeon D-1602 supports up to 128 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 34.1 GB/s. |
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Qualcomm Snapdragon 778G+ | Characteristic | Intel Xeon D-1602 |
LPDDR5-6400 | Memory | DDR4-2133 |
16 GB | Max. Memory | 128 GB |
2 (Dual Channel) | Memory channels | 2 (Dual Channel) |
25.6 GB/s | Max. Bandwidth | 34.1 GB/s |
No | ECC | Yes |
-- | L2 Cache | 3.00 MB |
2.00 MB | L3 Cache | -- |
-- | PCIe version | 3.0 |
-- | PCIe lanes | 32 |
-- | PCIe Bandwidth | 31.5 GB/s |
Thermal ManagementThe thermal design power (TDP for short) of the Qualcomm Snapdragon 778G+ is --, while the Intel Xeon D-1602 has a TDP of 27 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Qualcomm Snapdragon 778G+ | Characteristic | Intel Xeon D-1602 |
-- | TDP (PL1 / PBP) | 27 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Qualcomm Snapdragon 778G+ is manufactured in 6 nm and has 2.00 MB cache. The Intel Xeon D-1602 is manufactured in 14 nm and has a 3.00 MB cache. |
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Qualcomm Snapdragon 778G+ | Characteristic | Intel Xeon D-1602 |
6 nm | Technology | 14 nm |
Chiplet | Chip design | Monolithic |
Armv8-A (64 bit) | Instruction set (ISA) | x86-64 (64 bit) |
-- | ISA extensions | SSE4.1, SSE4.2, AVX2 |
-- | Socket | BGA 1667 |
None | Virtualization | VT-x, VT-x EPT, VT-d |
No | AES-NI | Yes |
Android | Operating systems | Windows 10, Linux |
Q4/2021 | Release date | Q2/2019 |
-- | Release price | 113 $ |
show more data | show more data | |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 3.20 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 2.90 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 3.20 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 2.90 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 2.50 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 2.90 GHz |
Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
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Intel Xeon D-1602
2C 4T @ 2.50 GHz |
Devices using this processor |
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Qualcomm Snapdragon 778G+ | Intel Xeon D-1602 |
Unknown | Unknown |