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Qualcomm Snapdragon 765 vs MediaTek Dimensity 930
Last updated:
Benchmarks
Performance Overview
Average performance across multiple benchmarks
Single-core performance
Multi-core performance
Geekbench 5, 64bit Single-Core
Single-core performance
8C / 8T · 2.30 GHz
MediaTek Dimensity 930
100 %
8C / 8T · 2.20 GHz
Geekbench 5, 64bit Multi-Core
Multi-core performance
8C / 8T · 2.30 GHz
MediaTek Dimensity 930
100 %
8C / 8T · 2.20 GHz
iGPU - FP32 Performance (Single-precision GFLOPS)
Qualcomm Snapdragon 765
100 %
Qualcomm Adreno 620
PowerVR IMG AXM-8-256
AnTuTu 8 Benchmark
8C / 8T · 2.30 GHz
MediaTek Dimensity 930
100 %
8C / 8T · 2.20 GHz
More benchmarks
Specifications
At a glance
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| Family | Qualcomm Snapdragon (105) | Mediatek Dimensity (38) |
| CPU group | Qualcomm Snapdragon 760 (3) | MediaTek Dimensity 900 (3) |
| Architecture | Kryo 475 | Cortex-A78 / Cortex-A55 |
| Technology | 7 nm | 6 nm |
| Segment | Smartphone / Tablet | Smartphone / Tablet |
| Socket | ||
| Predecessor | ||
| Successor |
CPU Cores and Base Frequency
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| CPU Cores / Threads | 8 / 8 | 8 / 8 |
| Hyperthreading / SMT | ✗ | ✗ |
| Core architecture | hybrid (big.LITTLE) | hybrid (big.LITTLE) |
| Core Cluster 1: | 1x Kryo 475 Prime 2.30 GHz |
2x Cortex-A78 2.20 GHz |
| Core Cluster 2: | 1x Kryo 475 Gold 2.20 GHz |
6x Cortex-A55 2.00 GHz |
| Core Cluster 3: | 6x Kryo 475 Silver 1.80 GHz |
|
| L2-Cache | ||
| L3-Cache | 2.00 MB | |
| Overclocking | ✗ | ✗ |
Integrated graphics (iGPU)
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| GPU name | Qualcomm Adreno 620 | PowerVR IMG AXM-8-256 |
| GPU frequency | 0.63 GHz | 1.00 GHz |
| CUs / Shader | / 192 | 8 / |
| Raytracing | ✗ | ✗ |
| Max. displays | 2 | 0 |
| Max. GPU Memory | 4 GB | |
| Technology | 7 nm | |
| Release date | Q2/2019 | Q4/2019 |
NPU AI performance
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| AI hardware | Qualcomm AI engine | |
| AI specifications | Hexagon 696 @ 5.5 TOPS | |
| NPU + CPU + iGPU |
Memory & PCIe
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| Memory | LPDDR4-3733 (14.9 GB/s) | LPDDR5-6400 (51.2 GB/s) |
| Max. Memory | 12 GB | 16 GB |
| Memory channels | 2 | 4 |
| ECC | No | No |
| PCIe | ||
| PCIe Bandwidth |
Thermal Management
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| TDP | 5 W | |
| TDP (PL2) | ||
| TDP up | ||
| TDP down | ||
| T. junction max. |
Technical details
|
Wischen
|
Qualcomm Snapdragon 765 | MediaTek Dimensity 930 |
|---|---|---|
| Chip design | Chiplet | Chiplet |
| AES-NI | ✗ | ✗ |
| Operating systems | Android | Android |
| Instruction set | Armv8-A (64 bit) | Armv8-A (64 bit) |
| ISA extensions | ||
| Release date | Q3/2020 | Q3/2022 |
| Release price | ||
| Documents | Technical data sheet | Technical data sheet |
User Reviews
Your rating
Here you can rate one or both of the processors. The average rating of Qualcomm Snapdragon 765 is 5.0 stars (2 ratings), while MediaTek Dimensity 930 has received 4.3 stars (12 ratings).
Click on the stars to rate one or both processors.
Most popular CPUs in both categories
1
Qualcomm Snapdragon 765
8C / 8T · 0.00 GHz
2
MediaTek Dimensity 8300
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3
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4
MediaTek Dimensity 9300
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5
Qualcomm Snapdragon 8s Gen 3
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MediaTek Dimensity 9300+
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7
Apple A15 Bionic (4-GPU)
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8
MediaTek Dimensity 9400
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9
MediaTek Dimensity 930
8C / 8T · 0.00 GHz
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