MediaTek Dimensity 8100 | Qualcomm Snapdragon 8cx Gen. 2 | |
CPU comparisonMediaTek Dimensity 8100 or Qualcomm Snapdragon 8cx Gen. 2 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 8100 has 8 cores with 8 threads and clocks with a maximum frequency of 2.85 GHz. Up to 16 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 8100 was released in Q1/2022. The Qualcomm Snapdragon 8cx Gen. 2 has 8 cores with 8 threads and clocks with a maximum frequency of 3.15 GHz. The CPU supports up to 32 GB of memory in 8 memory channels. The Qualcomm Snapdragon 8cx Gen. 2 was released in Q4/2018. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (104) |
MediaTek Dimensity 8000 (4) | CPU group | Qualcomm Snapdragon 8cx (2) |
3 | Generation | 2 |
Cortex-A78 / Cortex-A55 | Architecture | Kryo 495 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | Qualcomm Snapdragon 8cx Gen 3 |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 8100 has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 8100 is 2.85 GHz while the Qualcomm Snapdragon 8cx Gen. 2 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 8cx Gen. 2 is at 3.15 GHz. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 8cx Gen. 2 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.85 GHz 4x Cortex-A78 |
A-Core | 3.15 GHz 4x Kryo 495 Gold |
2.00 GHz 4x Cortex-A55 |
B-Core | 1.80 GHz 4x Kryo 495 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 8cx Gen. 2 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 690 @ 7 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The MediaTek Dimensity 8100 or Qualcomm Snapdragon 8cx Gen. 2 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G610 MP6 | GPU | Qualcomm Adreno 690 |
GPU frequency | 0.25 GHz | |
-- | GPU (Turbo) | 0.59 GHz |
Vallhall 3 | GPU Generation | 6 |
4 nm | Technology | 7 nm |
1 | Max. displays | 0 |
6 | Compute units | -- |
-- | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | -- |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G610 MP6 | GPU | Qualcomm Adreno 690 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode / Encode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 8100 can use up to 16 GB of memory in 4 memory channels. The maximum memory bandwidth is 51.2 GB/s. The Qualcomm Snapdragon 8cx Gen. 2 supports up to 32 GB of memory in 8 memory channels and achieves a memory bandwidth of up to 68.2 GB/s. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 8cx Gen. 2 |
LPDDR5-6400 | Memory | LPDDR4X-4266 |
16 GB | Max. Memory | 32 GB |
4 (Quad Channel) | Memory channels | 8 (Octa Channel) |
51.2 GB/s | Max. Bandwidth | 68.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | 2.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 8100 is --, while the Qualcomm Snapdragon 8cx Gen. 2 has a TDP of 7 W. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 8cx Gen. 2 |
-- | TDP (PL1 / PBP) | 7 W |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 8100 is manufactured in 5 nm and has 0.00 MB cache. The Qualcomm Snapdragon 8cx Gen. 2 is manufactured in 7 nm and has a 2.00 MB cache. |
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MediaTek Dimensity 8100 | Characteristic | Qualcomm Snapdragon 8cx Gen. 2 |
5 nm | Technology | 7 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android, Windows 10 (ARM) |
Q1/2022 | Release date | Q4/2018 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
MediaTek Dimensity 8100
8C 8T @ 2.85 GHz |
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Qualcomm Snapdragon 8cx Gen. 2
8C 8T @ 3.15 GHz |
Devices using this processor |
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MediaTek Dimensity 8100 | Qualcomm Snapdragon 8cx Gen. 2 |
Unknown | Lenovo Flex 5G Lenovo Yoga C 5G Samsung Galaxy Book S |