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MediaTek Dimensity 6100+ | Qualcomm Snapdragon 616 | |
CPU comparisonMediaTek Dimensity 6100+ or Qualcomm Snapdragon 616 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 6100+ has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 12 GB of memory is supported in 2 memory channels. The MediaTek Dimensity 6100+ was released in Q3/2023. The Qualcomm Snapdragon 616 has 8 cores with 8 threads and clocks with a maximum frequency of 1.70 GHz. The CPU supports up to 4 GB of memory in 1 memory channels. The Qualcomm Snapdragon 616 was released in Q3/2015. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (104) |
MediaTek Dimensity 6000 (3) | CPU group | Qualcomm Snapdragon 610 (4) |
0 | Generation | 2 |
Cortex-A76 / Cortex-A55 | Architecture | Cortex-A53 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 6100+ has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 6100+ is 2.20 GHz while the Qualcomm Snapdragon 616 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 616 is at 1.70 GHz. |
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MediaTek Dimensity 6100+ | Characteristic | Qualcomm Snapdragon 616 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.20 GHz 2x Cortex-A76 |
A-Core | 1.70 GHz 4x Cortex-A53 |
2.00 GHz 6x Cortex-A55 |
B-Core | 1.20 GHz 4x Cortex-A53 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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MediaTek Dimensity 6100+ | Characteristic | Qualcomm Snapdragon 616 |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon V50 |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The MediaTek Dimensity 6100+ or Qualcomm Snapdragon 616 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G57 MP2 | GPU | Qualcomm Adreno 405 |
1.10 GHz | GPU frequency | 0.55 GHz |
1.10 GHz | GPU (Turbo) | 0.55 GHz |
Vallhall 1 | GPU Generation | 4 |
7 nm | Technology | 28 nm |
2 | Max. displays | 0 |
2 | Compute units | -- |
32 | Shader | 48 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | 11 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G57 MP2 | GPU | Qualcomm Adreno 405 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | No |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | No |
Decode / Encode | Codec VP8 | No |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | No |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 6100+ can use up to 12 GB of memory in 2 memory channels. The maximum memory bandwidth is 17.1 GB/s. The Qualcomm Snapdragon 616 supports up to 4 GB of memory in 1 memory channels and achieves a memory bandwidth of up to 6.4 GB/s. |
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MediaTek Dimensity 6100+ | Characteristic | Qualcomm Snapdragon 616 |
LPDDR4X-4266 | Memory | LPDDR3-1600 |
12 GB | Max. Memory | 4 GB |
2 (Dual Channel) | Memory channels | 1 (Single Channel) |
17.1 GB/s | Max. Bandwidth | 6.4 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 6100+ is --, while the Qualcomm Snapdragon 616 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 6100+ | Characteristic | Qualcomm Snapdragon 616 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 6100+ is manufactured in 7 nm and has 0.00 MB cache. The Qualcomm Snapdragon 616 is manufactured in 28 nm and has a 0.00 MB cache. |
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MediaTek Dimensity 6100+ | Characteristic | Qualcomm Snapdragon 616 |
7 nm | Technology | 28 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2023 | Release date | Q3/2015 |
-- | Release price | -- |
show more data | show more data | |
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MediaTek Dimensity 6100+
ARM Mali-G57 MP2 @ 1.10 GHz |
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Qualcomm Snapdragon 616
Qualcomm Adreno 405 @ 0.55 GHz |
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MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 616
8C 8T @ 1.70 GHz |
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MediaTek Dimensity 6100+
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 616
8C 8T @ 1.70 GHz |
Devices using this processor |
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MediaTek Dimensity 6100+ | Qualcomm Snapdragon 616 |
Unknown | Unknown |