MediaTek Dimensity 1000L | Qualcomm Snapdragon 7c+ Gen 3 | |
CPU comparisonMediaTek Dimensity 1000L or Qualcomm Snapdragon 7c+ Gen 3 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The MediaTek Dimensity 1000L has 8 cores with 8 threads and clocks with a maximum frequency of 2.20 GHz. Up to 12 GB of memory is supported in 4 memory channels. The MediaTek Dimensity 1000L was released in Q1/2020. The Qualcomm Snapdragon 7c+ Gen 3 has 8 cores with 8 threads and clocks with a maximum frequency of 2.40 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 7c+ Gen 3 was released in Q1/2022. |
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Mediatek Dimensity (36) | Family | Qualcomm Snapdragon (104) |
MediaTek Dimensity 1000 (4) | CPU group | Qualcomm Snapdragon 7c Plus (1) |
1 | Generation | 3 |
Cortex-A77 / Cortex-A55 | Architecture | Cortex-A78 / Cortex-A55 |
Mobile | Segment | Mobile |
-- | Predecessor | Qualcomm Snapdragon 7c Gen 2 |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe MediaTek Dimensity 1000L has 8 CPU cores and can calculate 8 threads in parallel. The clock frequency of the MediaTek Dimensity 1000L is 2.20 GHz while the Qualcomm Snapdragon 7c+ Gen 3 has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 7c+ Gen 3 is at 2.40 GHz. |
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MediaTek Dimensity 1000L | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (big.LITTLE) | Core architecture | hybrid (big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.20 GHz 4x Cortex-A77 |
A-Core | 2.40 GHz 4x Cortex-A78 |
2.00 GHz 4x Cortex-A55 |
B-Core | 1.50 GHz 4x Cortex-A55 |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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MediaTek Dimensity 1000L | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
Mediatek APU 3.0 | AI hardware | -- |
-- | AI specifications | -- |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The MediaTek Dimensity 1000L or Qualcomm Snapdragon 7c+ Gen 3 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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ARM Mali-G77 MP7 | GPU | Qualcomm Adreno 642L |
0.70 GHz | GPU frequency | 0.70 GHz |
-- | GPU (Turbo) | -- |
Vallhall 1 | GPU Generation | 5 |
7 nm | Technology | 6 nm |
1 | Max. displays | 1 |
7 | Compute units | 4 |
112 | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | 4 GB |
12 | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G77 MP7 | GPU | Qualcomm Adreno 642L |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode |
Decode / Encode | Codec VP8 | Decode |
Decode | Codec AV1 | No |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe MediaTek Dimensity 1000L can use up to 12 GB of memory in 4 memory channels. The maximum memory bandwidth is 29.8 GB/s. The Qualcomm Snapdragon 7c+ Gen 3 supports up to 16 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 51.2 GB/s. |
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MediaTek Dimensity 1000L | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
LPDDR4X-1866 | Memory | LPDDR5-6400, LPDDR4X-4266 |
12 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 2 (Dual Channel) |
29.8 GB/s | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | -- |
-- | L3 Cache | -- |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the MediaTek Dimensity 1000L is --, while the Qualcomm Snapdragon 7c+ Gen 3 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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MediaTek Dimensity 1000L | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
-- | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe MediaTek Dimensity 1000L is manufactured in 7 nm and has 0.00 MB cache. The Qualcomm Snapdragon 7c+ Gen 3 is manufactured in 6 nm and has a 0.00 MB cache. |
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MediaTek Dimensity 1000L | Characteristic | Qualcomm Snapdragon 7c+ Gen 3 |
7 nm | Technology | 6 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q1/2020 | Release date | Q1/2022 |
-- | Release price | -- |
show more data | show more data | |
MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000L
ARM Mali-G77 MP7 @ 0.70 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
Qualcomm Adreno 642L @ 0.70 GHz |
MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
MediaTek Dimensity 1000L
8C 8T @ 2.20 GHz |
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Qualcomm Snapdragon 7c+ Gen 3
8C 8T @ 2.40 GHz |
Devices using this processor |
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MediaTek Dimensity 1000L | Qualcomm Snapdragon 7c+ Gen 3 |
Unknown | Unknown |