Intel Xeon W-3335 | Qualcomm Snapdragon 778G+ | |
CPU comparisonIntel Xeon W-3335 or Qualcomm Snapdragon 778G+ - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The Intel Xeon W-3335 has 16 cores with 32 threads and clocks with a maximum frequency of 4.00 GHz. Up to 4096 GB of memory is supported in 8 memory channels. The Intel Xeon W-3335 was released in Q3/2021. The Qualcomm Snapdragon 778G+ has 8 cores with 8 threads and clocks with a maximum frequency of 2.50 GHz. The CPU supports up to 16 GB of memory in 2 memory channels. The Qualcomm Snapdragon 778G+ was released in Q4/2021. |
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Intel Xeon W (83) | Family | Qualcomm Snapdragon (104) |
Intel Xeon W-3300 (5) | CPU group | Qualcomm Snapdragon 778 (2) |
8 | Generation | 4 |
Ice Lake W | Architecture | Kryo 670 |
Desktop / Server | Segment | Mobile |
Intel Xeon W-3235 | Predecessor | -- |
Intel Xeon w5-3435X | Successor | -- |
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CPU Cores and Base FrequencyThe Intel Xeon W-3335 has 16 CPU cores and can calculate 32 threads in parallel. The clock frequency of the Intel Xeon W-3335 is 3.40 GHz (4.00 GHz) while the Qualcomm Snapdragon 778G+ has 8 CPU cores and 8 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 778G+ is at 2.50 GHz. |
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Intel Xeon W-3335 | Characteristic | Qualcomm Snapdragon 778G+ |
16 | Cores | 8 |
32 | Threads | 8 |
normal | Core architecture | hybrid (Prime / big.LITTLE) |
Yes | Hyperthreading | No |
No | Overclocking ? | No |
3.40 GHz (4.00 GHz) | A-Core | 2.50 GHz 1x Kryo 670 Prime |
-- | B-Core | 2.20 GHz 3x Kryo 670 Gold |
-- | C-Core | 1.90 GHz 4x Kryo 670 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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Intel Xeon W-3335 | Characteristic | Qualcomm Snapdragon 778G+ |
-- | AI hardware | Qualcomm AI engine |
-- | AI specifications | Hexagon 770 @ 12 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The Intel Xeon W-3335 or Qualcomm Snapdragon 778G+ has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die. |
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no iGPU | GPU | Qualcomm Adreno 642L |
GPU frequency | -- | |
-- | GPU (Turbo) | -- |
-- | GPU Generation | 5 |
Technology | 6 nm | |
Max. displays | 1 | |
-- | Compute units | 4 |
-- | Shader | 384 |
No | Hardware Raytracing | No |
No | Frame Generation | No |
-- | Max. GPU Memory | 4 GB |
-- | DirectX Version | 12.0 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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no iGPU | GPU | Qualcomm Adreno 642L |
No | Codec h265 / HEVC (8 bit) | Decode |
No | Codec h265 / HEVC (10 bit) | Decode |
No | Codec h264 | Decode / Encode |
No | Codec VP9 | Decode |
No | Codec VP8 | Decode |
No | Codec AV1 | No |
No | Codec AVC | Decode |
No | Codec VC-1 | Decode |
No | Codec JPEG | Decode / Encode |
Memory & PCIeThe Intel Xeon W-3335 can use up to 4096 GB of memory in 8 memory channels. The maximum memory bandwidth is 204.8 GB/s. The Qualcomm Snapdragon 778G+ supports up to 16 GB of memory in 2 memory channels and achieves a memory bandwidth of up to 25.6 GB/s. |
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Intel Xeon W-3335 | Characteristic | Qualcomm Snapdragon 778G+ |
DDR4-3200 | Memory | LPDDR5-6400 |
4096 GB | Max. Memory | 16 GB |
8 (Octa Channel) | Memory channels | 2 (Dual Channel) |
204.8 GB/s | Max. Bandwidth | 25.6 GB/s |
Yes | ECC | No |
20.00 MB | L2 Cache | -- |
24.00 MB | L3 Cache | 2.00 MB |
4.0 | PCIe version | -- |
64 | PCIe lanes | -- |
126.0 GB/s | PCIe Bandwidth | -- |
Thermal ManagementThe thermal design power (TDP for short) of the Intel Xeon W-3335 is 250 W, while the Qualcomm Snapdragon 778G+ has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently. |
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Intel Xeon W-3335 | Characteristic | Qualcomm Snapdragon 778G+ |
250 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe Intel Xeon W-3335 is manufactured in 10 nm and has 44.00 MB cache. The Qualcomm Snapdragon 778G+ is manufactured in 6 nm and has a 2.00 MB cache. |
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Intel Xeon W-3335 | Characteristic | Qualcomm Snapdragon 778G+ |
10 nm | Technology | 6 nm |
Monolithic | Chip design | Chiplet |
x86-64 (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
SSE4.1, SSE4.2, AVX2, AVX-512 | ISA extensions | -- |
LGA 4189 | Socket | -- |
VT-x, VT-x EPT, VT-d | Virtualization | None |
Yes | AES-NI | No |
Windows 10, Linux | Operating systems | Android |
Q3/2021 | Release date | Q4/2021 |
1299 $ | Release price | -- |
show more data | show more data | |
Intel Xeon W-3335
16C 32T @ 4.00 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Intel Xeon W-3335
16C 32T @ 3.80 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Intel Xeon W-3335
16C 32T @ 4.00 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Intel Xeon W-3335
16C 32T @ 3.80 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Intel Xeon W-3335
16C 32T @ 3.40 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Intel Xeon W-3335
16C 32T @ 3.80 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Intel Xeon W-3335
16C 32T @ 3.40 GHz |
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Qualcomm Snapdragon 778G+
8C 8T @ 2.50 GHz |
Devices using this processor |
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Intel Xeon W-3335 | Qualcomm Snapdragon 778G+ |
Unknown | Unknown |