Intel Xeon W-11555MRE vs Qualcomm Snapdragon 610

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CPU comparison with benchmarks


Intel Xeon W-11555MRE CPU1 vs CPU2 Qualcomm Snapdragon 610
Intel Xeon W-11555MRE Qualcomm Snapdragon 610

CPU comparison

Intel Xeon W-11555MRE or Qualcomm Snapdragon 610 - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.

The Intel Xeon W-11555MRE has 6 cores with 12 threads and clocks with a maximum frequency of 4.50 GHz. Up to 128 GB of memory is supported in 2 memory channels. The Intel Xeon W-11555MRE was released in Q3/2021.

The Qualcomm Snapdragon 610 has 4 cores with 4 threads and clocks with a maximum frequency of 1.70 GHz. The CPU supports up to 4 GB of memory in 1 memory channels. The Qualcomm Snapdragon 610 was released in Q3/2014.
Intel Xeon W (83) Family Qualcomm Snapdragon (104)
Intel Xeon W-11000M (8) CPU group Qualcomm Snapdragon 610 (4)
11 Generation 2
Tiger Lake H Architecture Cortex-A53
Mobile Segment Mobile
-- Predecessor --
-- Successor --

CPU Cores and Base Frequency

The Intel Xeon W-11555MRE has 6 CPU cores and can calculate 12 threads in parallel. The clock frequency of the Intel Xeon W-11555MRE is 2.60 GHz (4.50 GHz) while the Qualcomm Snapdragon 610 has 4 CPU cores and 4 threads can calculate simultaneously. The clock frequency of the Qualcomm Snapdragon 610 is at 1.70 GHz.

Intel Xeon W-11555MRE Characteristic Qualcomm Snapdragon 610
6 Cores 4
12 Threads 4
normal Core architecture normal
Yes Hyperthreading No
No Overclocking ? No
2.60 GHz Frequency 1.70 GHz
4.50 GHz Turbo Frequency (1 Core) --
3.40 GHz Turbo Frequency (All Cores) --

NPU AI performance

The performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors.

Intel Xeon W-11555MRE Characteristic Qualcomm Snapdragon 610
-- AI hardware Qualcomm AI engine
-- AI specifications Hexagon V50
-- NPU + CPU + iGPU --

Integrated graphics (iGPU)

The Intel Xeon W-11555MRE or Qualcomm Snapdragon 610 has integrated graphics, called iGPU for short. The iGPU uses the system's main memory as graphics memory and sits on the processor's die.

Intel UHD Graphics 11th Gen (32 EU) GPU Qualcomm Adreno 405
0.35 GHz GPU frequency 0.55 GHz
1.35 GHz GPU (Turbo) 0.55 GHz
11 GPU Generation 4
10 nm Technology 28 nm
3 Max. displays 0
32 Compute units --
256 Shader 48
No Hardware Raytracing No
No Frame Generation No
64 GB Max. GPU Memory --
12 DirectX Version 11

Hardware codec support

A photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos.

Intel UHD Graphics 11th Gen (32 EU) GPU Qualcomm Adreno 405
Decode / Encode Codec h265 / HEVC (8 bit) Decode
Decode / Encode Codec h265 / HEVC (10 bit) No
Decode / Encode Codec h264 Decode / Encode
Decode / Encode Codec VP9 No
Decode / Encode Codec VP8 No
Decode Codec AV1 No
Decode / Encode Codec AVC No
Decode Codec VC-1 Decode
Decode / Encode Codec JPEG Decode / Encode

Memory & PCIe

The Intel Xeon W-11555MRE can use up to 128 GB of memory in 2 memory channels. The maximum memory bandwidth is 51.2 GB/s. The Qualcomm Snapdragon 610 supports up to 4 GB of memory in 1 memory channels and achieves a memory bandwidth of up to 6.4 GB/s.

Intel Xeon W-11555MRE Characteristic Qualcomm Snapdragon 610
DDR4-3200 Memory LPDDR3-1600
128 GB Max. Memory 4 GB
2 (Dual Channel) Memory channels 1 (Single Channel)
51.2 GB/s Max. Bandwidth 6.4 GB/s
Yes ECC No
-- L2 Cache --
12.00 MB L3 Cache --
4.0 PCIe version --
20 PCIe lanes --
39.4 GB/s PCIe Bandwidth --

Thermal Management

The thermal design power (TDP for short) of the Intel Xeon W-11555MRE is 45 W, while the Qualcomm Snapdragon 610 has a TDP of --. The TDP specifies the necessary cooling solution that is required to cool the processor sufficiently.

Intel Xeon W-11555MRE Characteristic Qualcomm Snapdragon 610
45 W TDP (PL1 / PBP) --
-- TDP (PL2) --
-- TDP up --
35 W TDP down --
100 °C Tjunction max. --

Technical details

The Intel Xeon W-11555MRE is manufactured in 10 nm and has 12.00 MB cache. The Qualcomm Snapdragon 610 is manufactured in 28 nm and has a 0.00 MB cache.

Intel Xeon W-11555MRE Characteristic Qualcomm Snapdragon 610
10 nm Technology 28 nm
Monolithic Chip design Chiplet
x86-64 (64 bit) Instruction set (ISA) Armv8-A (64 bit)
SSE4.1, SSE4.2, AVX2, AVX-512 ISA extensions --
BGA 1787 Socket --
VT-x, VT-x EPT, VT-d Virtualization None
Yes AES-NI No
Operating systems Android
Q3/2021 Release date Q3/2014
326 $ Release price --
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iGPU - FP32 Performance (Single-precision GFLOPS)

The theoretical computing performance of the internal graphics unit of the processor with simple accuracy (32 bit) in GFLOPS. GFLOPS indicates how many billion floating point operations the iGPU can perform per second.
Intel Xeon W-11555MRE Intel Xeon W-11555MRE
Intel UHD Graphics 11th Gen (32 EU) @ 1.35 GHz
691 (100%)
Qualcomm Snapdragon 610 Qualcomm Snapdragon 610
Qualcomm Adreno 405 @ 0.55 GHz
53 (8%)

Devices using this processor

Intel Xeon W-11555MRE Qualcomm Snapdragon 610
Unknown Unknown

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