HiSilicon Kirin 990 5G | Qualcomm Snapdragon 888+ | |
CPU comparisonHiSilicon Kirin 990 5G or Qualcomm Snapdragon 888+ - which processor is faster? In this comparison we look at the differences and analyze which of these two CPUs is better. We compare the technical data and benchmark results.
The HiSilicon Kirin 990 5G has 8 cores with 8 threads and clocks with a maximum frequency of 2.86 GHz. Up to 8 GB of memory is supported in 4 memory channels. The HiSilicon Kirin 990 5G was released in Q3/2019. The Qualcomm Snapdragon 888+ has 8 cores with 8 threads and clocks with a maximum frequency of 3.00 GHz. The CPU supports up to 16 GB of memory in 4 memory channels. The Qualcomm Snapdragon 888+ was released in Q3/2021. |
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HiSilicon Kirin (29) | Family | Qualcomm Snapdragon (104) |
HiSilicon Kirin 990 (3) | CPU group | Qualcomm Snapdragon 888 (2) |
8 | Generation | 8 |
Cortex-A76 / Cortex-A55 | Architecture | Kryo 680 |
Mobile | Segment | Mobile |
-- | Predecessor | -- |
-- | Successor | -- |
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CPU Cores and Base FrequencyThe HiSilicon Kirin 990 5G is a 8 core processor with a clock frequency of 2.86 GHz. The Qualcomm Snapdragon 888+ has 8 CPU cores with a clock frequency of 3.00 GHz. |
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HiSilicon Kirin 990 5G | Characteristic | Qualcomm Snapdragon 888+ |
8 | Cores | 8 |
8 | Threads | 8 |
hybrid (Prime / big.LITTLE) | Core architecture | hybrid (Prime / big.LITTLE) |
No | Hyperthreading | No |
No | Overclocking ? | No |
2.86 GHz 2x Cortex-A76 |
A-Core | 3.00 GHz 1x Kryo 680 Prime |
2.36 GHz 2x Cortex-A76 |
B-Core | 1.80 GHz 3x Kryo 680 Gold |
1.95 GHz 4x Cortex-A55 |
C-Core | -- 4x Kryo 680 Silver |
NPU AI performanceThe performance values of the processor's AI unit. The isolated NPU performance is specified here, the total AI performance (NPU+CPU+iGPU) can be higher. Processors with support for artificial intelligence (AI) and machine learning (ML) can process many calculations, especially audio, image and video processing, much faster than classic processors. |
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HiSilicon Kirin 990 5G | Characteristic | Qualcomm Snapdragon 888+ |
HUAWEI HiAI 2.0 | AI hardware | Qualcomm AI engine |
Da Vinci Architecture. 1x Ascend Lite + 1x Ascend Tiny | AI specifications | Hexagon 780 @ 32 TOPS |
-- | NPU + CPU + iGPU | -- |
Integrated graphics (iGPU)The integrated graphics unit of a processor is not only responsible for the pure image output on the system, but can also significantly increase the efficiency of the system with the support of modern video codecs. |
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ARM Mali-G76 MP16 | GPU | Qualcomm Adreno 660 AV1 |
0.60 GHz | GPU frequency | 0.84 GHz |
-- | GPU (Turbo) | -- |
Bifrost 3 | GPU Generation | 6 |
7 nm | Technology | 5 nm |
2 | Max. displays | 0 |
16 | Compute units | -- |
256 | Shader | -- |
No | Hardware Raytracing | No |
No | Frame Generation | No |
4 GB | Max. GPU Memory | -- |
12 | DirectX Version | 12.1 |
Hardware codec supportA photo or video codec that is accelerated in hardware can greatly accelerate the working speed of a processor and extend the battery life of notebooks or smartphones when playing videos. |
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ARM Mali-G76 MP16 | GPU | Qualcomm Adreno 660 AV1 |
Decode / Encode | Codec h265 / HEVC (8 bit) | Decode / Encode |
Decode / Encode | Codec h265 / HEVC (10 bit) | Decode / Encode |
Decode / Encode | Codec h264 | Decode / Encode |
Decode / Encode | Codec VP9 | Decode / Encode |
Decode / Encode | Codec VP8 | Decode / Encode |
No | Codec AV1 | Decode |
Decode / Encode | Codec AVC | Decode |
Decode / Encode | Codec VC-1 | Decode |
Decode / Encode | Codec JPEG | Decode / Encode |
Memory & PCIeThe HiSilicon Kirin 990 5G supports a maximum of 8 GB of memory in 4 memory channels. The Qualcomm Snapdragon 888+ can connect up to 16 GB of memory in 4 memory channels. |
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HiSilicon Kirin 990 5G | Characteristic | Qualcomm Snapdragon 888+ |
LPDDR4X-4266 | Memory | LPDDR5-6400 |
8 GB | Max. Memory | 16 GB |
4 (Quad Channel) | Memory channels | 4 (Quad Channel) |
-- | Max. Bandwidth | 51.2 GB/s |
No | ECC | No |
-- | L2 Cache | 4.00 MB |
2.00 MB | L3 Cache | 4.00 MB |
-- | PCIe version | -- |
-- | PCIe lanes | -- |
-- | PCIe Bandwidth | -- |
Thermal ManagementThe TDP (Thermal Design Power) of a processor specifies the required cooling solution. The HiSilicon Kirin 990 5G has a TDP of 6 W, that of the Qualcomm Snapdragon 888+ is --. |
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HiSilicon Kirin 990 5G | Characteristic | Qualcomm Snapdragon 888+ |
6 W | TDP (PL1 / PBP) | -- |
-- | TDP (PL2) | -- |
-- | TDP up | -- |
-- | TDP down | -- |
-- | Tjunction max. | -- |
Technical detailsThe HiSilicon Kirin 990 5G has a 2.00 MB cache, while the Qualcomm Snapdragon 888+ cache has a total of 8.00 MB. |
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HiSilicon Kirin 990 5G | Characteristic | Qualcomm Snapdragon 888+ |
7 nm | Technology | 5 nm |
Chiplet | Chip design | Chiplet |
Armv8-A (64 bit) | Instruction set (ISA) | Armv8-A (64 bit) |
-- | ISA extensions | -- |
-- | Socket | -- |
None | Virtualization | None |
No | AES-NI | No |
Android | Operating systems | Android |
Q3/2019 | Release date | Q3/2021 |
-- | Release price | -- |
show more data | show more data | |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
ARM Mali-G76 MP16 @ 0.60 GHz |
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Qualcomm Snapdragon 888+
Qualcomm Adreno 660 AV1 @ 0.84 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
HiSilicon Kirin 990 5G
8C 8T @ 2.86 GHz |
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Qualcomm Snapdragon 888+
8C 8T @ 3.00 GHz |
Devices using this processor |
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HiSilicon Kirin 990 5G | Qualcomm Snapdragon 888+ |
Unknown | Unknown |